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单相混合逆变器解决方案
英飞凌为混合组串式逆变器提供的半导体产品包括功率晶体管、栅极驱动器、传感器、控制和连接等
-
在本页
概览
混合逆变器为自用开辟了新的大门,同时减少了建造光伏系统所需的材料量、空间和复杂性。它们不仅可以连接多个光伏电池板并将产生的直流电转换为交流电,还可以将直流电直接供应给蓄电池等储能系统。通过集成 ESS 组件,混合逆变器消除了不必要的功率转换,从而减少了损耗。
产品优势
- 一站式半导体商店
- 高效功率晶体管
- 定制栅极驱动器 ( EiceDRIVER™ )
- 精确电流传感器 ( XENSIV™ )
- 功能强大的微控制器 (XMC™)
- 辅助电源 (CoolSET™)
- Wi-Fi 和蓝牙® IC (AIROC™)
- 坚固的数字隔离器 (ISOFACE™)
- 多种存储器 ( EXCELON™ )
- 高质量和可靠性
- 设计使用寿命长
- 满足最苛刻的要求
框图
关于
英飞凌的单相混合组串逆变器解决方案涵盖从电源和感测到控制和连接的各种应用场景。这些逆变器通常是对流冷却的,因此需要功率晶体管要兼具合理的 BoM 和较高的效率。为实现最佳的性价比,推荐使用英飞凌的分立式 IGBT、MOSFET、CoolGaN™ HEMT、CoolSiC™ MOSFET和 CoolSiC™ 肖特基二极管。
所有开关都需要驱动器,所有驱动器都需要控制。我们的 EiceDRIVER™ 栅极驱动器以及 XMC™ 和 PSOC™ 微控制器也可用于您的逆变器设计。由于每个功能块都需要一个传感器和辅助电源,您可了解我们的 CoolSET™ 集成功率级以及 TLI4971 和 TLE4971 电流传感器,以完善您的设计。AIROC™ 系列是用于解决连接的智能组合解决方案,为单设备提供独立的 Bluetooth® 和Wi-Fi。此外,EXCELON™ F-RAM 支持存储器扩展,ISOFACE™ 数字隔离器提供可靠的有线通信路径。
英飞凌 TrenchSTOP™ IGBT 和 CoolMOS™ N 沟道 MOSFET 产品用于实现各种应用,满足最严格的应用要求,成功经受了二十多年的市场考验。
同时,我们的碳化硅 CoolSiC™ MOSFET 技术为设计人员开创了新的灵活设计实践,将效率和可靠性提升到了前所未有的水平。高压 CoolSiC™ MOSFET 技术在反向恢复特性方面也取得了令人瞩目的改进。
另一方面,英飞凌的 CoolGaN™ 是一种高效的GaN(氮化镓)晶体管技术,可在高达600 V的电压范围内进行功率转换。凭借在半导体市场的丰富经验,英飞凌的氮化镓技术使 e-mode 概念走向成熟,实现了端到端的大批量生产。
EiceDRIVER™ 2EDi 是双通道隔离式栅极驱动器 IC 产品系列,可在高性能CoolMOS™、CoolSiC™ 和 OptiMOS™ MOSFET 半桥中稳健地运行。这些产品用于初级和次级侧控制的硬开关和软开关拓扑结构。它们对于优化功率转换效率以及确保在标称和异常运行下实现稳健的开关模式电源运行至关重要。此外,我们的 EiceDRIVER™ 栅极驱动器系列包括隔离式栅极驱动器 IC、电平转换栅极驱动器 IC 和专为所有应用中的 IGBT 分立器件和模块优化的低侧栅极驱动器 IC。功能包括:去饱和检测(DESAT)、有源米勒钳位、短路钳位、过流保护、欠压锁定(UVLO)、压摆率控制(SRC)、两级关断、软关断和电隔离。这些保护功能在驱动 IGBT 时起到重要作用,对于高可靠性应用(如太阳能逆变器、电动汽车充电、储能、UPS 等)的设计更是如此。
与基于磁芯的电流传感器相比,英飞凌 XENSIV™ 系列高精度无磁芯开环电流传感器体积更小,成本也更低。基于英飞凌精确稳定的霍尔效应电流传感器 IC 技术,电流传感器模拟输出信号在温度和使用寿命范围内具有非常好的线性度。由于没有铁芯或通量收集器,传感器信号没有磁滞和饱和现象。差分电流传感器测量使用了两个霍尔单元,即使在嘈杂的环境例如有来自相邻电流线或杂散磁场的串扰,也可确保其高精度。系统设计人员可以对传感器的灵敏度以及两个专用过流信号的阈值电平进行编程,因此无需任何外部元件即可根据个人要求进行调整。非接触式电流传感器 IC 还会在电源电压过压或欠压情况下发出警告信号。
微控制器单元(MCU)在 IC 芯片上集成了 CPU、存储器和输入/输出外围设备,是一台小型独立计算机。这可以降低功耗,使设计更紧凑,并节省成本。此外,微控制器能够为嵌入式系统提供功能安全和保障。每个微控制器都需要配备电源,英飞凌的 CoolSET™ AC-DC 集成功率级为电源提供额外的保护,提高控制器系统的稳健性。为了实现快速启动性能,第五代控制器利用高压电源集成电路和内部 AC-DC 开关稳压器,以安全、快速的方式操作启动序列,这通常被称为级联配置。
EXCELON™ 系列内存产品提供高能效、高密度和可靠的数据记录。英飞凌的下一代铁电 RAM(F-RAM)存储器通过将超低功耗操作与高速接口、即时非易失性和无限读/写周期耐久性相结合,提供业界功耗最低、任务关键型非易失性存储器。
您可以去了解英飞凌 AIROC™ Wi-Fi 和 Bluetooth® 组合产品,该产品组合提供多种安全、稳健的解决方案,助力您更快地将优质产品推向市场。AIROC™ Wi-Fi 和 Bluetooth® SoC 包括片上 MCU、内存和网络协议,让您轻松创建自己的云连接应用。
英飞凌的单相混合组串逆变器解决方案涵盖从电源和感测到控制和连接的各种应用场景。这些逆变器通常是对流冷却的,因此需要功率晶体管要兼具合理的 BoM 和较高的效率。为实现最佳的性价比,推荐使用英飞凌的分立式 IGBT、MOSFET、CoolGaN™ HEMT、CoolSiC™ MOSFET和 CoolSiC™ 肖特基二极管。
所有开关都需要驱动器,所有驱动器都需要控制。我们的 EiceDRIVER™ 栅极驱动器以及 XMC™ 和 PSOC™ 微控制器也可用于您的逆变器设计。由于每个功能块都需要一个传感器和辅助电源,您可了解我们的 CoolSET™ 集成功率级以及 TLI4971 和 TLE4971 电流传感器,以完善您的设计。AIROC™ 系列是用于解决连接的智能组合解决方案,为单设备提供独立的 Bluetooth® 和Wi-Fi。此外,EXCELON™ F-RAM 支持存储器扩展,ISOFACE™ 数字隔离器提供可靠的有线通信路径。
英飞凌 TrenchSTOP™ IGBT 和 CoolMOS™ N 沟道 MOSFET 产品用于实现各种应用,满足最严格的应用要求,成功经受了二十多年的市场考验。
同时,我们的碳化硅 CoolSiC™ MOSFET 技术为设计人员开创了新的灵活设计实践,将效率和可靠性提升到了前所未有的水平。高压 CoolSiC™ MOSFET 技术在反向恢复特性方面也取得了令人瞩目的改进。
另一方面,英飞凌的 CoolGaN™ 是一种高效的GaN(氮化镓)晶体管技术,可在高达600 V的电压范围内进行功率转换。凭借在半导体市场的丰富经验,英飞凌的氮化镓技术使 e-mode 概念走向成熟,实现了端到端的大批量生产。
EiceDRIVER™ 2EDi 是双通道隔离式栅极驱动器 IC 产品系列,可在高性能CoolMOS™、CoolSiC™ 和 OptiMOS™ MOSFET 半桥中稳健地运行。这些产品用于初级和次级侧控制的硬开关和软开关拓扑结构。它们对于优化功率转换效率以及确保在标称和异常运行下实现稳健的开关模式电源运行至关重要。此外,我们的 EiceDRIVER™ 栅极驱动器系列包括隔离式栅极驱动器 IC、电平转换栅极驱动器 IC 和专为所有应用中的 IGBT 分立器件和模块优化的低侧栅极驱动器 IC。功能包括:去饱和检测(DESAT)、有源米勒钳位、短路钳位、过流保护、欠压锁定(UVLO)、压摆率控制(SRC)、两级关断、软关断和电隔离。这些保护功能在驱动 IGBT 时起到重要作用,对于高可靠性应用(如太阳能逆变器、电动汽车充电、储能、UPS 等)的设计更是如此。
与基于磁芯的电流传感器相比,英飞凌 XENSIV™ 系列高精度无磁芯开环电流传感器体积更小,成本也更低。基于英飞凌精确稳定的霍尔效应电流传感器 IC 技术,电流传感器模拟输出信号在温度和使用寿命范围内具有非常好的线性度。由于没有铁芯或通量收集器,传感器信号没有磁滞和饱和现象。差分电流传感器测量使用了两个霍尔单元,即使在嘈杂的环境例如有来自相邻电流线或杂散磁场的串扰,也可确保其高精度。系统设计人员可以对传感器的灵敏度以及两个专用过流信号的阈值电平进行编程,因此无需任何外部元件即可根据个人要求进行调整。非接触式电流传感器 IC 还会在电源电压过压或欠压情况下发出警告信号。
微控制器单元(MCU)在 IC 芯片上集成了 CPU、存储器和输入/输出外围设备,是一台小型独立计算机。这可以降低功耗,使设计更紧凑,并节省成本。此外,微控制器能够为嵌入式系统提供功能安全和保障。每个微控制器都需要配备电源,英飞凌的 CoolSET™ AC-DC 集成功率级为电源提供额外的保护,提高控制器系统的稳健性。为了实现快速启动性能,第五代控制器利用高压电源集成电路和内部 AC-DC 开关稳压器,以安全、快速的方式操作启动序列,这通常被称为级联配置。
EXCELON™ 系列内存产品提供高能效、高密度和可靠的数据记录。英飞凌的下一代铁电 RAM(F-RAM)存储器通过将超低功耗操作与高速接口、即时非易失性和无限读/写周期耐久性相结合,提供业界功耗最低、任务关键型非易失性存储器。
您可以去了解英飞凌 AIROC™ Wi-Fi 和 Bluetooth® 组合产品,该产品组合提供多种安全、稳健的解决方案,助力您更快地将优质产品推向市场。AIROC™ Wi-Fi 和 Bluetooth® SoC 包括片上 MCU、内存和网络协议,让您轻松创建自己的云连接应用。
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