Background for document preview
Background for thumbnail

Coil on Module: packaging innovation for government ID

For government and issuing authorities, adding multiple applications to electronic ID cards translates into more frequent usage. Rather than only using the ID card for verification at a border crossing or for registration purposes, a multi-application card will be used on a daily basis. For the smart card industry this means the card has to be even more robust, durable and secure than ever before, while also bridging the gap between traditional and modern use case scenarios. This whitepaper explains how Infineon’s packaging innovations are designed to increase the durability and robustness of any kind of smart card while at the same time reducing cost for the manufacturer.

• 2.32 MB
• 27/11/2017