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Further Improvements in the Reliability of IGBT Modules

This paper gives a survey of the measures and the resulting improvements of IGBT module reliability reached by eupec during the introduction of IGBT high power modules. Since their market introduction in the beginning of 1995, eupec IGBT high power modules (IHM) got a quick access to several applications in the lower and medium voltage range because of their obvious advantages with regard to controllability, isolation and mounting. When introducing high voltage 3.3 kV IGBTs (IHV) intended for the upper power range and traction applications additional demands are made to the electrical and mechanical characteristics of the modules. These growing requirements will be met by continuous progresses in the module design in the areas of substrate, bond wire and base plate technology, partial discharge immunity as well as improvements of the electrical chip characteristics.

• 59.55 KB
• 07/02/2014