AR and smart glasses

Complete low‑power semiconductor platform for AI compute, connectivity, display, sensing, and intuitive interaction in AR and smart glasses

概述

AR and smart glasses are reshaping how people access information and interact with their surroundings while requiring slim designs, long battery life, and seamless experiences. Infineon offers a complete semiconductor platform, covering low power AI compute, Wi-Fi and Bluetooth® connectivity, natural voice and touch interfaces, advanced sensing, and efficient display solutions for designs from audio-first eyewear to full AR.

产品优势

  • Longer battery life
  • Compact, slim designs
  • Ultra-low-power AI compute
  • Robust Wi-Fi and Bluetooth®
  • Simplified system architecture
  • High quality audio
  • Advanced voice and touch HMI
  • End-to-end AI ML development

About

Maximize battery life with ultra-low-power computeAbout smart conference systems and speakerphones

Smart glasses must be able to run rich AI features without constantly draining the battery. PSOC™ Edge MCUs are built for this challenge, combining ultra low power always-on sensing with efficient AI acceleration. A dual domain architecture lets the device monitor motion, activity, and voice in very low power modes, and only wake higher performance compute when needed.

• Always-on sensing and voice triggers at very low power

• MCU based on Arm® Cortex®-M55 with Ethos™-U55 NPU for AI workloads

• Scalable memory for multiple AI and ML models

• Enables simpler architectures without an A class SoC

This approach supports thinner frames, longer operating time, and a highly responsive on device assistant experience.

Explore PSOC™ Edge AI/ML-enabled MCUs
Deliver robust connectivity with efficient Wi-Fi and Bluetooth®

AR and smart glasses need fast and reliable wireless links to smartphones, wearables, and the cloud. AIROC™ Wi-Fi + Bluetooth® combo solutions provide the throughput for video and data while staying optimized for low power usage Wi-Fi 6 and beyond enable smooth streaming and fast updates, while remaining efficient in typical submaximal transmit conditions.

• High data rates for live video and rich content 

• Bluetooth® support for audio accessories and controllers

• Low latency features for responsive interaction

• Smart Wi-Fi and Bluetooth® coexistence for crowded RF

Flexible host interfaces make integration into different system architectures simple, helping you deliver a connected experience without sacrificing battery life.

Discover AIROC™ Wi-Fi 6/6E + Bluetooth® combos
Explore Wi-Fi 7 (802.11be)
 Enable natural voice, touch, and gesture interaction

Users expect smart glasses to work like a hands free, voice first assistant that also supports subtle, simple gestures. Infineon’s HMI technologies combine high quality microphones, vibration based voice pickup, AI audio processing, and precise capacitive sensing to deliver this experience.

• XENSIV™ MEMS microphones and vibration sensors for clear voice

• Always-on wake word and voice activity detection

• AI audio enhancement for noise and echo reduction

• CAPSENSE™-based touch for taps and swipes along the frame

• Inductive sensing for temple folding detection and power control

These capabilities enable discreet, natural interaction without visible buttons, allowing designers to keep frames slim and stylish while still delivering powerful control and communication features.

Explore XENSIV™ MEMS microphones
PSOC™ 4000T MCUs with CAPSENSE™ technology for HMI
Accelerate development with DEEPCRAFT™ Edge AI suite

Delivering advanced AI features on smart glasses or AR glasses often requires specialized data science skills and long development cycles. The DEEPCRAFT™ Edge AI suite shortens this journey by providing production ready models, tools, and workflows tuned for PSOC™ Edge platforms.

Key capabilities:

• Voice assistant with custom wake words and commands

• Audio enhancement for noise suppression and echo control

• Computer vision models for face, people, and object detection

• Radar and sound classification models for gestures and events

• DEEPCRAFT™ Studio for data collection, training, and deployment

Teams can start from ready made models, adapt them to their data, and deploy efficiently to edge devices. This enables faster iteration, reduced risk, and a clearer path from prototype to production.

Learn how DEEPCRAFT™ simplifies development
Simplify AR and smart glasses design with a complete platform

Smart glasses require a tightly integrated system across compute, connectivity, HMI, display, and sensing. Infineon’s portfolio offers a complete platform that helps reduce design complexity and risk while improving time to market. PSOC™ Edge MCUs, AIROC™ connectivity, XENSIV™ sensors, MEMS microphones, and DEEPCRAFT™ software are designed to work together in AR and smart glasses use cases.

Key benefits: 

• Scalable performance and memory options

• Support for audio-first eyewear and full AR glasses

By building on a unified platform, you can focus more on product differentiation and user experience, and less on stitching together disparate building blocks.

Optimize system architecture with the SWI3S™ interface for microphones

Smart glasses typically use up to 6 MEMS microphones to ensure high-level audio capturing and beamforming. This leads to a challenge from a system architecture standpoint, as many cables have to be routed across the frame and hinges of the glasses. The new MIPI SWI3S™ interface for audio data enables synchronized multichannel audio among other things, thus allowing the total number of wires for 6 microphones to be reduced from 9 wires (PDM interface) to 2 wires. Infineon will soon introduce the market’s first MEMS microphones supporting the MIPI SWI3S™ interface to solve the microphone integration challenge and enable the audio evolution in smart glasses.

Revolutionize audio with SWI3S™ and XENSIV™ MEMS
Maximize battery life with ultra-low-power computeAbout smart conference systems and speakerphones

Smart glasses must be able to run rich AI features without constantly draining the battery. PSOC™ Edge MCUs are built for this challenge, combining ultra low power always-on sensing with efficient AI acceleration. A dual domain architecture lets the device monitor motion, activity, and voice in very low power modes, and only wake higher performance compute when needed.

• Always-on sensing and voice triggers at very low power

• MCU based on Arm® Cortex®-M55 with Ethos™-U55 NPU for AI workloads

• Scalable memory for multiple AI and ML models

• Enables simpler architectures without an A class SoC

This approach supports thinner frames, longer operating time, and a highly responsive on device assistant experience.

Explore PSOC™ Edge AI/ML-enabled MCUs
Deliver robust connectivity with efficient Wi-Fi and Bluetooth®

AR and smart glasses need fast and reliable wireless links to smartphones, wearables, and the cloud. AIROC™ Wi-Fi + Bluetooth® combo solutions provide the throughput for video and data while staying optimized for low power usage Wi-Fi 6 and beyond enable smooth streaming and fast updates, while remaining efficient in typical submaximal transmit conditions.

• High data rates for live video and rich content 

• Bluetooth® support for audio accessories and controllers

• Low latency features for responsive interaction

• Smart Wi-Fi and Bluetooth® coexistence for crowded RF

Flexible host interfaces make integration into different system architectures simple, helping you deliver a connected experience without sacrificing battery life.

Discover AIROC™ Wi-Fi 6/6E + Bluetooth® combos
Explore Wi-Fi 7 (802.11be)
 Enable natural voice, touch, and gesture interaction

Users expect smart glasses to work like a hands free, voice first assistant that also supports subtle, simple gestures. Infineon’s HMI technologies combine high quality microphones, vibration based voice pickup, AI audio processing, and precise capacitive sensing to deliver this experience.

• XENSIV™ MEMS microphones and vibration sensors for clear voice

• Always-on wake word and voice activity detection

• AI audio enhancement for noise and echo reduction

• CAPSENSE™-based touch for taps and swipes along the frame

• Inductive sensing for temple folding detection and power control

These capabilities enable discreet, natural interaction without visible buttons, allowing designers to keep frames slim and stylish while still delivering powerful control and communication features.

Explore XENSIV™ MEMS microphones
PSOC™ 4000T MCUs with CAPSENSE™ technology for HMI
Accelerate development with DEEPCRAFT™ Edge AI suite

Delivering advanced AI features on smart glasses or AR glasses often requires specialized data science skills and long development cycles. The DEEPCRAFT™ Edge AI suite shortens this journey by providing production ready models, tools, and workflows tuned for PSOC™ Edge platforms.

Key capabilities:

• Voice assistant with custom wake words and commands

• Audio enhancement for noise suppression and echo control

• Computer vision models for face, people, and object detection

• Radar and sound classification models for gestures and events

• DEEPCRAFT™ Studio for data collection, training, and deployment

Teams can start from ready made models, adapt them to their data, and deploy efficiently to edge devices. This enables faster iteration, reduced risk, and a clearer path from prototype to production.

Learn how DEEPCRAFT™ simplifies development
Simplify AR and smart glasses design with a complete platform

Smart glasses require a tightly integrated system across compute, connectivity, HMI, display, and sensing. Infineon’s portfolio offers a complete platform that helps reduce design complexity and risk while improving time to market. PSOC™ Edge MCUs, AIROC™ connectivity, XENSIV™ sensors, MEMS microphones, and DEEPCRAFT™ software are designed to work together in AR and smart glasses use cases.

Key benefits: 

• Scalable performance and memory options

• Support for audio-first eyewear and full AR glasses

By building on a unified platform, you can focus more on product differentiation and user experience, and less on stitching together disparate building blocks.

Optimize system architecture with the SWI3S™ interface for microphones

Smart glasses typically use up to 6 MEMS microphones to ensure high-level audio capturing and beamforming. This leads to a challenge from a system architecture standpoint, as many cables have to be routed across the frame and hinges of the glasses. The new MIPI SWI3S™ interface for audio data enables synchronized multichannel audio among other things, thus allowing the total number of wires for 6 microphones to be reduced from 9 wires (PDM interface) to 2 wires. Infineon will soon introduce the market’s first MEMS microphones supporting the MIPI SWI3S™ interface to solve the microphone integration challenge and enable the audio evolution in smart glasses.

Revolutionize audio with SWI3S™ and XENSIV™ MEMS
Documents

Design resources