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Hybrid switched-capacitor converter (HSC)
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在本页
概览
The proprietary hybrid switched-capacitor (HSC) converter topology for 48 V IBCs from Infineon enables high step-down conversion at high efficiency. By combining switching capacitor cells with a multi-tapped autotransformer (MTA), the HSC topology can provide high peak currents and reach the market leading power density and efficiency required for AI factories.
产品优势
- Reduced conduction losses
- High power density
- High efficiency solution
- High peak current capability
- Simplified drive system
- Soft switching operation
框图
关于
人工智能对数据中心电源的要求越来越高,而与此同时,实施电源转换解决方案的空间却越来越小。对更高功率密度的需求和对更高转换效率的追求推动了创新。
英飞凌在半导体行业拥有多年经验,已开发出多种可提供高效率、高密度并支持高峰值功率的新型拓扑结构。其中一种拓扑结构是混合开关电容器(HSC)。该结构同时具有开关电容器能量转移的优势和耦合磁性元件的降压优势。HSC 在 ZVS 模式下工作时不像传统 LLC 那样依赖于谐振元件的公差,可以在很宽的输入范围内高效工作。
利用英飞凌的 HSC 解决方案,可以在保持相同数量的 FET 的同时,采用不同的比率作为优化转换率,例如 5:1、6:1 或 8:1。通过不向系统添加额外的 FET,可以节省空间并降低成本。
利用 HSC,无论元件公差和输入电压变化如何,都可以实现软开关操作,因为 MTA 的 Lm 提供了软开关能力。MTA 的 Lk 确保 Cres1、Cres2 和 Cout 电容器的软充电。此外,简化的驱动系统无需电荷泵,这也有助于降低架构成本。该拓扑还具有对称操作,可降低输入电流纹波,从而提高系统效率。
在您的设计中使用 HSC 转换器拓扑可以帮助降低系统组件的数量,并且灵活的设计支持广泛的应用,具体取决于输入电压、输出电压、电流和功率水平。
英飞凌在 HSC 拓扑的基础上推出的4:1 非稳压同步混合开关电容器 (S-HSC) 拓扑是一种具有 4:1 固定比率的谐振软开关转换器。该解决方案价格低廉,BoM 低,无需电子保险丝即可启动。这使其具有高可靠性和成本效益,适合各种应用场合。
S-HSC 拓扑结构采用分离式谐振电容器,从而优化了并联铜的使用,并降低了自耦变压器的交流电阻。这将带来更高的效率和更低的功率损耗,使英飞凌的解决方案在市场上具有更高的兼容性。此外,谐振软开关和优化并联铜的使用降低了电磁干扰(EMI),因此可用于需要控制电磁干扰的场合,比如医疗设备、汽车电子和消费电子产品。
人工智能对数据中心电源的要求越来越高,而与此同时,实施电源转换解决方案的空间却越来越小。对更高功率密度的需求和对更高转换效率的追求推动了创新。
英飞凌在半导体行业拥有多年经验,已开发出多种可提供高效率、高密度并支持高峰值功率的新型拓扑结构。其中一种拓扑结构是混合开关电容器(HSC)。该结构同时具有开关电容器能量转移的优势和耦合磁性元件的降压优势。HSC 在 ZVS 模式下工作时不像传统 LLC 那样依赖于谐振元件的公差,可以在很宽的输入范围内高效工作。
利用英飞凌的 HSC 解决方案,可以在保持相同数量的 FET 的同时,采用不同的比率作为优化转换率,例如 5:1、6:1 或 8:1。通过不向系统添加额外的 FET,可以节省空间并降低成本。
利用 HSC,无论元件公差和输入电压变化如何,都可以实现软开关操作,因为 MTA 的 Lm 提供了软开关能力。MTA 的 Lk 确保 Cres1、Cres2 和 Cout 电容器的软充电。此外,简化的驱动系统无需电荷泵,这也有助于降低架构成本。该拓扑还具有对称操作,可降低输入电流纹波,从而提高系统效率。
在您的设计中使用 HSC 转换器拓扑可以帮助降低系统组件的数量,并且灵活的设计支持广泛的应用,具体取决于输入电压、输出电压、电流和功率水平。
英飞凌在 HSC 拓扑的基础上推出的4:1 非稳压同步混合开关电容器 (S-HSC) 拓扑是一种具有 4:1 固定比率的谐振软开关转换器。该解决方案价格低廉,BoM 低,无需电子保险丝即可启动。这使其具有高可靠性和成本效益,适合各种应用场合。
S-HSC 拓扑结构采用分离式谐振电容器,从而优化了并联铜的使用,并降低了自耦变压器的交流电阻。这将带来更高的效率和更低的功率损耗,使英飞凌的解决方案在市场上具有更高的兼容性。此外,谐振软开关和优化并联铜的使用降低了电磁干扰(EMI),因此可用于需要控制电磁干扰的场合,比如医疗设备、汽车电子和消费电子产品。
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