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Insulated signal transfer in a half bridge driver IC based on CLT

Signal transmission across an insulation is a technical challenge in many applications. State of the art solutions use either optical devices (opto-couplers; fibre optics) or magnetic pulse transformers. By integrating two planar coils on a silicon die, an inexpensive coreless transformer has been developed, that incorporates the advantages of a pulse transformer into an IC. This paper gives information on transmission behavior, insulation capability and potential fields of application of the new technology. Main idea of the coreless transformer technology is to combine the advantages of a pulse transformer with the advantages of IC production technologies. For realization the logic functions of the transmitter are built into a primary die. The secondary die holds the receiver as well as primary and secondary windings of the transformer. Both dies are soldered to a split lead frame. Connection between transmitter and primary side of the transformer is made by wire-bonding. Afterwards the chip set is covered in molding compound.

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353.79 KB
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07/01/2008