新品
现货，推荐
符合RoHS标准
无铅

ESD118-B1-W01005

新品
Bi-directional ESD protection device, 3.3 V, 0.9 pF, 01005
数据手册
封装
每件.
有存货

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ESD118-B1-W01005
ESD118-B1-W01005
每件.
数据手册

商品详情

  • CL
    0.9 pF
  • IEFT
    60 A
  • IPP
    8 A
  • IR
    1 nA
  • Rdyn
    0.17 Ω
  • Vcl typ. reverse (@16A)
    8.6 V
  • Vcl typ. reverse (TLP 30A)
    11 V
  • VWM
    3.3 V
  • 保护线路
    1
推荐的
OPN
ESD118B1W01005E6327XTSA1
产品状态 active and preferred
英飞凌封装名称
SG-WLL-2
封装名 N/A
包装尺寸 15000
包装类型 TAPE & REEL
湿度 1
防潮包装 NON DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes
Infineon stock last updated:
 每件. 有存货

产品状态
Active
英飞凌封装名称
SG-WLL-2
封装名 -
包装尺寸 15000
包装类型 TAPE & REEL
湿度 1
防潮包装 NON DRY
无铅
无卤素
符合 RoHS 标准
每件.
有存货
This Infineon ESD (electrostatic discharge) protection device has a bi-directional and symmetric I/V characteristic and excellent clamping performance.

特性

  • ESD / transient protection according to: IEC61000-4-2 (ESD): ±29 kV (air) / ±29 kV (contact), IEC61000-4-4 (EFT): ±3 kV / ±60 A (5/50 ns), IEC61000-4-5 (Surge): ±8 A (8/20 μs)
  • Bi-directional maximum working voltage: VWM = ±3.3 V
  • Diode type I/V characteristic
  • Line capacitance: CL = 0.9 pF at f = 1 MHz
  • Clamping voltage: VCL = 8.6 V at ITLP = 16 A with Rdyn = 0.17 Ω
  • Low leakage current: IL = 1 nA
  • Small form factor SMD size, low profile (0.43 x 0.23 x 0.15 mm³)

产品优势

  • Low insertion loss
  • Low clamping
  • Bi-directional protection device
  • Ultra-small package

应用

文档

文档

设计资源

合作伙伴解决方案

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