新品
现货，推荐
符合RoHS标准

FF1000UXTR23T2M1_B5

新品
CoolSiC™ MOSFET halfbridge module 2.3 kV
数据手册

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FF1000UXTR23T2M1_B5
FF1000UXTR23T2M1_B5
数据手册

商品详情

  • RDS (on) (@ Tj = 25°C)
    0.95 mΩ
  • Housing
    XHP™ 2
  • Dimensions (length)
    140 mm
  • Dimensions (width)
    100 mm
  • Applications
    Renewables, H2, Traction, ESS
  • Features
    .XT interconnection technology
  • Qualification
    Traction, Industrial
  • Configuration
    Half-bridge
受到推崇的
OPN
FF1000UXTR23T2M1B5BPSA1
产品状态 active and preferred
英飞凌封装名称 AG-XHP2K33
封装名 N/A
包装尺寸 1
包装类型 TRAY
湿度 NA
防潮包装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 Yes
Infineon stock last updated:

产品状态
Active
英飞凌封装名称 AG-XHP2K33
封装名 -
包装尺寸 1
包装类型 TRAY
湿度 NA
防潮包装 NON DRY
无铅
无卤素
符合 RoHS 标准
XHP™ 2 CoolSiC™ MOSFET 2.3 kV, 1.0 mΩ with halfbridge topology and robust .XT interconnection technology for enhanced lifetime with best in class reliability.

特性

  • Integrated body diode
  • .XT interconnection technology
  • Symmetrical module design
  • Lowest switching and conduction losses
  • Tvj=175°C continuous
  • 6 kV isolation voltage
  • AlSiC baseplate
  • Benefits: Energy efficiency
  • High power density
  • Enhanced lifetime
  • Best in class reliability

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