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XENSIV™ - Efficient Use of the 2nd Generation 3D Hall Sensors

The Infineon 3D magnetic sensors are highly configurable devices that fit many applications. A microcontroller is used in a bidirectional I²C communication to communicate with the sensor and read out the magnetic field measurements. In the firmware it is possible to optimize the measurement for the target applications needs. In this application note it is explained how a low noise measurement can be performed. It strongly interacts with the update rate and the power consumption of the sensor. The information provides help to find the ideal trade-off for the target application. To simplify the design-in, three typical sensor configuration and readout schemes are described in detail. It is intended as a starting point to efficiently use the sensor to achieve the desired design targets. The document is valid for all 3D magnetic sensors of the second generation, including the variants: • TLE493D-P2B6 A0...A3 • TLE493D-W2B6 A0...A3 • TLE493D-A2B6 • TLI493D-W2BW A0...A3 • TLI493D-A2B6 • TLV493D-A2BW

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• 07/06/2022