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IGBT with higher operation temperature - Power density, lifetime and impact on inverter design

The development of IGBT power modules has always been characterized by the continuous increase of the power density for cost reduction and design optimization of the complete frequency converter system. The requirement of higher power density is directly associated with increased current per chip area and therefore an increase of the junction temperature during the operation is expected. The cooling conditions related to applications like hybrid vehicle are further important drivers for the need of an increase of the junction temperature. The reason for this is that for cost improvement the cooling of the IGBT module is combined with the combustion engine’s cooling system, which reaches temperatures in the range of 120°C. This paper focuses on the most important questions for the application of power modules with increased junction temperature: How much more inverter output current can be achieved per chip area? How much can the cooling effort be reduced? How does the temperature rise influence further inverter components and what are the consequences? How is the influence to IGBT module`s lifetime expectation?

• 477.61 KB
• 31/05/2011