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SSO8 Half-Bridge package thermal data sheet

This document aims at providing information about the thermal characteristics of Infineon’s SSO8 half-bridge packages PG-TDSON-8-56/57, used for Infineon MOSFETs (Grade-0). The document contains details regarding dimensions, package outline, products involved, and a detailed overview on the thermal resistance characteristics of the package. Please refer to the thermal resistance document if you need more information on thermal resistance calculation and background.

• 2.04 MB
• 27/12/2022