CY7C15632KV18-450BZXC
现货，推荐
符合RoHS标准
无铅

CY7C15632KV18-450BZXC

数据手册
封装

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CY7C15632KV18-450BZXC
CY7C15632KV18-450BZXC
数据手册


商品详情

  • Frequency
    450 MHz
  • 密度
    72 MBit
  • 峰值回流温度
    260 °C
  • 工作温度 范围
    0 °C 至 70 °C
  • 工作电压 范围
    1.7 V 至 1.9 V
  • 引线球表面
    Sn/Ag/Cu
  • 接口
    Parallel
  • 系列
    QDR-II+
  • 组织(X x Y)
    4M x 18
  • 质量等级
    Commercial

推荐的
OPN
CY7C15632KV18-450BZXC
产品状态 active and preferred
英飞凌封装名称
PG-BGA-165
封装名 FBGA-165 (51-85180)
封装尺寸 680
封装类型 TRAY
湿度 3
防潮封装 DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes
封装产地
TH
晶圆产地
TW

产品状态
Active
英飞凌封装名称
PG-BGA-165
封装名 FBGA-165 (51-85180)
封装尺寸 680
封装类型 TRAY
湿度 3
防潮封装 DRY
无铅
无卤素
符合 RoHS 标准
封装产地
TH
晶圆产地
TW
CY7C15632KV18-450BZXC is a 72-Mbit QDR II+ synchronous pipelined SRAM (4 M × 18) with separate read and write ports to eliminate bus turnarounds. It supports a 450 MHz clock and DDR transfers on both ports, plus four-word burst operation with 2.5-cycle read latency. It operates from 0°C to 70°C with core VDD of 1.8 V ±0.1 V and VDDQ from 1.4 V to VDD, in a 165-ball FBGA Pb-free package.

特性

  • QDR II+ SRAM, 72 Mbit
  • Separate read/write data ports
  • Concurrent read and write access
  • 500 MHz clock operation
  • DDR I/O, 1000 MHz data transfer
  • Four-word burst architecture
  • 2.5-cycle read latency (DOFF=H)
  • Echo clocks CQ/CQ for capture
  • QVLD pin indicates valid data
  • IEEE 1149.1 JTAG boundary scan

产品优势

  • 72 Mbit fits large buffers
  • No bus turnaround, higher BW
  • Parallel R/W cuts contention
  • 500 MHz supports high throughput
  • DDR doubles data rate per clock
  • Burst lowers address bus toggling
  • Predictable latency simplifies timing
  • CQ/CQ eases high-speed capture
  • QVLD reduces read data errors
  • JTAG speeds board test/debug

应用

文档

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