现货，推荐

CY7C2665KV18-450BZI

数据手册
封装

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CY7C2665KV18-450BZI
CY7C2665KV18-450BZI
数据手册

商品详情

  • ECC
    N
  • Density
    144 MBit
  • Peak Reflow Temp
    260 °C
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    1.7 V to 1.9 V
  • Lead Ball Finish
    Sn/Pb
  • Interfaces
    Parallel
  • Data Width
    x 36
  • Architecture
    QDR-II+, ODT
  • On-Die Termination
    Y
  • Family
    QDR-II+, ODT
  • Organization (X x Y)
    4Mb x 36
  • Burst Length (Words)
    4
  • Currently planned availability until at least
    2033
  • Qualification
    Industrial
  • Read Latency (Cycles)
    2.5
  • Bank Switching
    N
  • Frequency
    450 MHz
受到推崇的
OPN
CY7C2665KV18-450BZI
产品状态 active and preferred
英飞凌封装名称
P-BGA-165
封装名 FBGA-165 (51-85195)
包装尺寸 105
包装类型 TRAY
湿度 3
防潮包装 DRY
无铅 No
无卤素 Yes
符合RoHS标准 No
Infineon stock last updated:

产品状态
Active
英飞凌封装名称
P-BGA-165
封装名 FBGA-165 (51-85195)
包装尺寸 105
包装类型 TRAY
湿度 3
防潮包装 DRY
无铅
无卤素
符合 RoHS 标准

应用

文档

文档

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开发者社区

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