CY7C2670KV18-450BZI
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CY7C2670KV18-450BZI

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CY7C2670KV18-450BZI
CY7C2670KV18-450BZI


商品详情

  • ECC
    N
  • Frequency
    450 MHz
  • 密度
    144 MBit
  • 峰值回流温度
    260 °C
  • 工作温度 范围
    -40 °C 至 85 °C
  • 工作电压 范围
    1.7 V 至 1.9 V
  • 引线球表面
    Sn/Pb
  • 接口
    Parallel
  • 数据宽度
    x 36
  • 架构
    DDR-II+ CIO, ODT
  • 片上端接
    Y
  • 系列
    DDR-II+ CIO, ODT
  • 组织(X x Y)
    4Mb x 36
  • 脉冲长度 (Words)
    2
  • 读取延迟(周期)
    2.5
  • 质量等级
    Industrial
  • 银行切换
    N

OPN
CY7C2670KV18-450BZI
产品状态 active and preferred
英飞凌封装名称
封装名 FBGA-165 (51-85195)
封装尺寸 105
封装类型 TRAY
湿度 3
防潮封装 DRY
无铅 No
无卤素 Yes
符合RoHS标准 No
封装产地
TH
晶圆产地
TW

产品状态
Active
英飞凌封装名称
封装名 FBGA-165 (51-85195)
封装尺寸 105
封装类型 TRAY
湿度 3
防潮封装 DRY
无铅
无卤素
符合 RoHS 标准
封装产地
TH
晶圆产地
TW
CY7C2670KV18-450BZI is a 144-Mbit (4 M × 36) DDR II+ synchronous pipelined SRAM with two-word burst architecture and 2.5-cycle read latency. It runs up to 450 MHz clock with double data rate transfers (up to 900 MT/s) and includes echo clocks (CQ/CQ) plus QVLD for data capture. Core VDD is 1.7 V to 1.9 V and VDDQ is 1.4 V to VDD. It comes in a 165-ball FBGA package for industrial range.

特性

  • 144-Mbit (4 M × 36) DDR II+ SRAM
  • 550 MHz clock, 1100 MHz data rate
  • Two-word burst architecture
  • 2.5-cycle read latency (DOFF high)
  • DDR I mode, 1-cycle latency (DOFF low)
  • Two input clocks K/K (DDR timing)
  • Echo clocks CQ/CQ for data capture
  • QVLD pin flags valid read data
  • On-die termination for D,BWS,K/K
  • ZQ pin sets output impedance (RQ)
  • Byte write via BWS[3:0]
  • IEEE 1149.1 JTAG boundary scan

产品优势

  • High bandwidth at 550 MHz clocking
  • Burst reduces address bus toggling
  • Select latency to fit timing margin
  • Precise DDR timing with K/K clocks
  • CQ/CQ simplifies receiver capture
  • QVLD cuts read timing uncertainty
  • ODT removes external term resistors
  • Fewer parts lowers BOM and area
  • ZQ tracking improves signal integrity
  • Byte writes ease RMW and save cycles
  • Posted-write avoids read/write clash
  • JTAG speeds board test and debug

应用

文档

设计资源

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