新品
现货，推荐
符合RoHS标准

F3L8MXTR12C2M2_H11

新品
CoolSiC™ MOSFET M2 .XT 3-level module 1200 V
数据手册
每件.
有存货

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F3L8MXTR12C2M2_H11
F3L8MXTR12C2M2_H11
每件.
数据手册

商品详情

  • RDS (on) (@ Tj = 25°C)
    8.3 mΩ
  • 封装
    Easy 2C
  • 尺寸 (length)
    57.1 mm
  • 尺寸 (width)
    62.8 mm
  • 应用
    DC-DC Conerter, EV Charger
  • 特性
    .XT interconnection technology, PressFIT
  • 认证标准
    Industrial
  • 配置
    3-Level
推荐的
OPN
F3L8MXTR12C2M2H11BPSA1
产品状态 active and preferred
英飞凌封装名称 AG-EASY2C
封装名 N/A
包装尺寸 15
包装类型 TRAY
湿度 NA
防潮包装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 Yes
Infineon stock last updated:
 每件. 有存货

产品状态
Active
英飞凌封装名称 AG-EASY2C
封装名 -
包装尺寸 15
包装类型 TRAY
湿度 NA
防潮包装 NON DRY
无铅
无卤素
符合 RoHS 标准
每件.
有存货
EasyPACK™ 2C CoolSiC™ MOSFET M2 .XT, 3-level module 1200 V, 8 mΩ with NTC temperature sensor and high current PressFIT contact technology

特性

  • Improved package concept
  • .XT interconnection technology
  • CoolSiC M2 chip technology
  • High current PressFIT pins
  • Integrated NTC temperature sensor
  • Overload conditions up to Tvj over=200°C
  • Enlarged gate-source voltage window

产品优势

  • Outstanding module efficiency
  • System efficiency improvement
  • Enhanced lifetime
  • High temperature withstand capability
  • Reduction of static losses
  • Compact design
  • Full compability to Easy Pack B™

图表

F3L8_Circut
F3L8_Circut
F3L8_Circut F3L8_Circut F3L8_Circut
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