SLC27PDL456H9

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

SLC27PDL456H9
SLC27PDL456H9

商品详情

  • CPU
    TEGRION™ 32-bit Arm® v8-M
  • NVM ( 非易失性存储器)
    456 kByte
  • RAM
    20 kByte
  • 交付表单
    dual-interface module sawn wafer
  • 对称加密
    AES up to 256-bit DES 3DES
  • 应用
    Payment
  • 接口
    TEGRION™ 32-bit Arm® v8-M, ISO 14443 A/B ISO 18092 F ISO 7816
  • 环境温度
    -25 °C to 85 °C
  • 认证
    EMVCo CC EAL6+ high
  • 非对称加密
    ECC up to 521-bit RSA up to 4096-bit NRG
OPN
产品状态
英飞凌封装名称
封装名
包装尺寸
包装类型
湿度
防潮包装
无铅
无卤素
符合RoHS标准
Infineon stock last updated:

文档

文档

设计资源

合作伙伴解决方案

开发者社区

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "向社区提问", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "查看所有讨论", "labelEn" : "View all discussions" } ] }