DEMO BGT60ATR24AIP
新品
在产
符合RoHS标准

DEMO BGT60ATR24AIP

新品
Demo kit for XENSIV™ BGT60ATR24AIP 60 GHz radar sensor
User manual
Video

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DEMO BGT60ATR24AIP
DEMO BGT60ATR24AIP
User manual


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OPN
DEMOBGT60ATR24AIPTOBO1
产品状态 active
英飞凌封装名称 N/A
封装名 N/A
封装尺寸 1
封装类型 CONTAINER
湿度 N/A
防潮封装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 Yes

产品状态
Active
英飞凌封装名称 N/A
封装名 -
封装尺寸 1
封装类型 CONTAINER
湿度 -
防潮封装 NON DRY
无铅
无卤素
符合 RoHS 标准
This demo kit features the XENSIV™ BGT60ATR24AIP shield mounted on the Radar Baseboard MCU7 Plus via Hirose connectors. It supports the RDK and Radar Fusion GUI for sensor configuration and real-time radar visualization. At its core is the XENSIV™ BGT60ATR24AIP, a 60 GHz FMCW radar sensor with antenna-in-package (AiP) technology, featuring two transmit (Tx) and four receive (Rx) antennas. Compatible with MCU7 Plus and MCU7 baseboards.

特性

  • 17.2 x 12.55 mm² RF shield form factor
  • SPI for configuration and data transfer
  • 17.2 x 12.55 mm² radar shield size
  • 59.4 x 25.4 mm² baseboard size
  • Hi-Speed USB 2.0 interface
  • Operates with RDK and Radar Fusion GUI

产品优势

  • Real-time sensor data evaluation
  • Fast prototyping with RDK and Fusion GUI
  • Small size for in-cabin integration
  • Low power consumption

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