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Self acting PressFIT module

Customers of power electronics require more and more new, easy connection and mounting technologies. The PressFIT technology offers the possibility of solderless mounting combined with an improved reliability in comparison to soldering. To continue this approach, a new module platform based on PressFIT technology has been developed which furthermore offers an extremely fast and robust mounting concept to improve the manufacturing, reliability and design of the inverters. Special focus has been put on mechanical robustness. Avoiding the risk of DCB cracks resulting from controllable forces originating from the module design, was one of the main approaches. To demonstrate the robustness, some mechanical tests have been done. Regarding current module designs, there are three main improvement areas, which have to be combined in one solution: The approach is, to get a module which is suitable for a single step mounting process with a high mechanical robustness, in combination with a robust & solderless contact system.

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31/01/2011