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New PrimePACK™ package to lever IGBT5

The 5th generation IGBT and emitter controlled diode from Infineon Technologies allow for an increase in output current in the range of ≈300/0 on the same module footprint at a junction temperature of Tvj,op = 1750°C. In order to achieve the demanded module lifetime under these conditions, the new PrimePACK™ module generation makes use of the .XT technology. Expanding the power range to this extent, the maximum current is limited by the ampacity of the existing internal bus bars. Improvement in the new PrimePACK™ 3+ package is implemented using a second AC bus bar and AC power terminal. This solution leads to a strong reduction of the maximum internal temperature at 30% increased current and 25 K increased chip temperature with respect to the PrimePACK™ 3. The influence of the new AC-bus bar geometry on the current distribution and current flow in the bus bars is investigated. An inverter test demonstrates the benefit of the improved thermal management under real application conditions.

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04/11/2015