AS5966
即将推出
即将推出
符合RoHS标准
无铅

AS5966

4-Side Buttable 80-Pixel TSV ASIC with integrated PD array and ADC
数据手册

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AS5966
AS5966
数据手册


商品详情


OPN
AS5966-WLP-SAW
产品状态 coming soon
英飞凌封装名称 --
封装名 N/A
封装尺寸 1
封装类型 HORIZONTAL FRAME SHIPPER
湿度 N/A
防潮封装 NON DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes
封装产地
DE
晶圆产地
AT

产品状态 coming soon
英飞凌封装名称 --
封装名 -
封装尺寸 1
封装类型 HORIZONTAL FRAME SHIPPER
湿度 -
防潮封装 NON DRY
无铅
无卤素
符合 RoHS 标准
封装产地
DE
晶圆产地
AT
The AS5966 is a sensor chip for CT detectors that combines the photodiodes and the readout circuit on a single CMOS chip using through silicon vias (TSV). This sensor solution, which integrates 10 x 8 photodiodes array with pixel dimension of 1.1x1.02 mm² and an 80-channel ADC on top of each other, allowing the assembly of the pixel array on four adjacent edges of the device. It has high performance incl. ultra-low noise and power consumption.

特性

  • ADC and PD integration using TSV technology
  • Lowest input related noise of 0.38 fC
  • Low power dissipation of 0.94 mW/pixel
  • Integration time of min. 195.5 μs
  • 15 MHz CMOS level interface

产品优势

  • 4-Side Buttable for Z-coverage of 2-16 cm
  • Pixel size 1.1 x 1.02 mm² with customization
  • No need of X-ray shield for ADC protection

应用

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