CY7C1371KV33-133AXC
现货,推荐
符合RoHS标准
无铅

CY7C1371KV33-133AXC

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CY7C1371KV33-133AXC
CY7C1371KV33-133AXC


商品详情

  • ECC
    N
  • Frequency
    133 MHz
  • 密度
    18 MBit
  • 峰值回流温度
    260 °C
  • 工作温度 范围
    0 °C 至 70 °C
  • 工作电压 范围
    3.135 V 至 3.6 V
  • 引线球表面
    Pure Sn
  • 接口
    Parallel
  • 数据宽度
    x 36
  • 架构
    NoBL, Flow-through
  • 片上端接
    N
  • 目前计划的可用性至少到
    2031
  • 系列
    NoBL
  • 组织(X x Y)
    512Kb x 36
  • 脉冲长度 (Words)
    4
  • 读取延迟(周期)
    1
  • 质量等级
    Commercial
  • 银行切换
    N

OPN
CY7C1371KV33-133AXC
产品状态 active and preferred
英飞凌封装名称
封装名 TQFP-100 (51-85050)
封装尺寸 144
封装类型 TRAY
湿度 3
防潮封装 DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes
预估长期供货截止日期 2031
产品发布日期 03/2022
封装产地
TW
晶圆产地
TW

产品状态
Active
英飞凌封装名称
封装名 TQFP-100 (51-85050)
封装尺寸 144
封装类型 TRAY
湿度 3
防潮封装 DRY
无铅
无卤素
符合 RoHS 标准
预估长期供货截止日期 2031
产品发布日期 03/2022
封装产地
TW
晶圆产地
TW
The CY7C1371KV33-133AXC is an 18-Mbit synchronous flow-through burst SRAM (512K × 36) with NoBL architecture for true back-to-back read/write transfers with no wait states. It supports bus operation up to 133 MHz with 6.5 ns clock-to-data valid, linear or interleaved 4-beat bursts, byte write control, and on-chip ECC. Commercial grade, 3.3 V core with 2.5 V/3.3 V VDDQ I/O, in 100-pin TQFP.

特性

  • NoBL architecture, no dead cycles
  • Up to 133 MHz, zero wait states
  • 6.5 ns clock-to-output (133 MHz)
  • Data on every clock cycle
  • Burst: linear or interleaved
  • Byte write via BWx + WE
  • Registered synchronous inputs
  • Self-timed synchronous writes
  • Asynchronous OE output control
  • 3 chip enables (CE1/CE2/CE3)
  • Sleep mode via ZZ; 2tCYC entry/exit
  • On-chip ECC lowers soft errors

产品优势

  • Seamless read/write switching
  • High throughput at 133 MHz bus
  • Faster access for tight timing
  • Predictable per-cycle transfers
  • Efficient burst data streaming
  • Update bytes without full writes
  • Simplifies synchronous timing
  • Reliable writes at high speed
  • Easy bus tri-state control
  • Simple bank selection/expansion
  • Cut standby power in sleep
  • Better data integrity in radiation

应用

文档

设计资源

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