CY7C1441KVE33-133AXC
现货,推荐
符合RoHS标准
无铅

CY7C1441KVE33-133AXC

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

CY7C1441KVE33-133AXC
CY7C1441KVE33-133AXC


商品详情

  • ECC
    Y
  • Frequency
    133 MHz
  • 密度
    36 MBit
  • 峰值回流温度
    260 °C
  • 工作温度 范围
    0 °C 至 70 °C
  • 工作电压 范围
    3.14 V 至 3.63 V
  • 引线球表面
    Ni/Pd/Au
  • 接口
    Parallel
  • 数据宽度
    x 36
  • 架构
    Standard Sync, Flow-through
  • 片上端接
    N
  • 目前计划的可用性至少到
    2031
  • 系列
    Synchronous SRAM with ECC
  • 组织(X x Y)
    1Mb x 36
  • 读取延迟(周期)
    1
  • 质量等级
    Commercial
  • 银行切换
    N

OPN
CY7C1441KVE33-133AXC
产品状态 active and preferred
英飞凌封装名称
封装名 TQFP-100 (51-85050)
封装尺寸 360
封装类型 TRAY
湿度 3
防潮封装 DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes
预估长期供货截止日期 2031
产品发布日期 03/2022
封装产地
PH
晶圆产地
TW

产品状态
Active
英飞凌封装名称
封装名 TQFP-100 (51-85050)
封装尺寸 360
封装类型 TRAY
湿度 3
防潮封装 DRY
无铅
无卤素
符合 RoHS 标准
预估长期供货截止日期 2031
产品发布日期 03/2022
封装产地
PH
晶圆产地
TW
CY7C1441KVE33-133AXC is a 36-Mbit synchronous flow-through SRAM organized as 1M × 36 with on-chip ECC. It supports 133 MHz bus operation with 6.5 ns clock-to-output and a 2-bit burst counter for linear or interleaved 2-1-1-1 bursts, initiated by ADSP or ADSC. Core supply is 3.135 V to 3.6 V with 2.5 V or 3.3 V I/O, JESD8-5 compatible, in a 100-pin TQFP Pb-free package (0°C to 70°C).

特性

  • 133 MHz synchronous bus
  • 6.5 ns clock-to-output
  • 3.0 ns OE to output valid
  • 1.5 ns setup to CLK rise
  • 3.3 V core (VDD 3.135-3.6 V)
  • 2.5 V or 3.3 V I/O supply
  • Common I/O: 1M×36 or 2M×18
  • Flow-through synchronous SRAM
  • 2-bit burst counter auto-increment
  • Interleaved or linear burst modes
  • IEEE 1149.1 JTAG boundary scan
  • On-chip ECC for SER reduction

产品优势

  • 133 MHz supports fast CPU buses
  • 6.5 ns cuts read data latency
  • 3.0 ns OE enables fast bus turn
  • 1.5 ns setup eases timing closure
  • 3.3 V core fits common power rails
  • 2.5/3.3 V I/O reduces level shift
  • Common I/O simplifies bus routing
  • Flow-through gives low-latency reads
  • Burst counter reduces glue logic
  • Burst modes match cache-line reads
  • JTAG boundary scan speeds test
  • ECC lowers soft-error field risk

应用

文档

设计资源

开发者社区