现货，推荐
符合RoHS标准

CYRS16B256-133FZMB

数据手册
封装
软件

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CYRS16B256-133FZMB
CYRS16B256-133FZMB
数据手册

商品详情

  • Density
    256 MBit
  • Peak Reflow Temp
    220 °C
  • Operating Temperature
    -55 °C to 125 °C
  • Operating Voltage
    3 V
  • Lead Ball Finish
    Ni/Au
  • Interface Bandwidth
    66 MByte/s
  • Interfaces
    Quad SPI
  • Interface Frequency (SDR/DDR) (MHz)
    133 / -
  • Family
    FL-L
  • Currently planned availability until at least
    2030
  • Qualification
    Military
  • Device weight
    3878.7 mg
受到推崇的
OPN
CYRS16B256-133FZMB
产品状态 active and preferred
英飞凌封装名称
CG-FP-36
封装名 FLATPACK-36 (002-26946)
包装尺寸 1
包装类型 CONTAINER
湿度 1
防潮包装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 Yes
Infineon stock last updated:

产品状态
Active
英飞凌封装名称
CG-FP-36
封装名 FLATPACK-36 (002-26946)
包装尺寸 1
包装类型 CONTAINER
湿度 1
防潮包装 NON DRY
无铅
无卤素
符合 RoHS 标准

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