ESD175-B1-W01005
现货，推荐
符合RoHS标准
无铅

ESD175-B1-W01005

Bi-directional ESD protection device, 1 V, 0.11 pF, 01005
数据手册
封装

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

ESD175-B1-W01005
ESD175-B1-W01005
数据手册

商品详情

  • CL
    0.11 pF
  • IEFT
    30 A
  • IPP
    4 A
  • IR
    30 nA
  • Rdyn
    0.28 Ω
  • Vcl typ. reverse (@16A)
    6.9 V
  • VWM
    1 V
  • 保护线路
    1
  • 环保认证
    Halogen free, RoHS compliant
推荐的
OPN
ESD175B1W01005E6327XTSA1
产品状态 active and preferred
英飞凌封装名称
SG-WLL-2
封装名 N/A
封装尺寸 15000
封装类型 TAPE & REEL
湿度 1
防潮封装 NON DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes

产品状态
Active
英飞凌封装名称
SG-WLL-2
封装名 -
封装尺寸 15000
封装类型 TAPE & REEL
湿度 1
防潮封装 NON DRY
无铅
无卤素
符合 RoHS 标准
This Infineon ESD (electrostatic discharge) protection device has a bi-directional and symmetric I/V characteristic and excellent clamping performance.

特性

  • ESD / transient protection of high-speed data lines exceeding: IEC61000-4-2 (ESD): 20 kV (air / contact), IEC61000-4-4 (EFT): 40 A (5/50 ns), IEC61000-4-5 (surge): 3 A (8/20 μs)
  • Bi-directional maximum working voltage: VWM = ±1 V
  • Diode type I/V characteristic with Vbr = 1.5 V at 1 mA
  • Line capacitance: CL = 0.11 pF at f = 5 GHz
  • Clamping voltage: VCL = 6.9 V at ITLP = 16 A with Rdyn = 0.28 Ω
  • Low leakage current: IL = 30 nA
  • Small form factor SMD size, low profile (0.43 x 0.23 x 0.15 mm³)

产品优势

  • Low insertion loss
  • Low clamping
  • Bi-directional protection device
  • Small package

应用

文档

设计资源

合作伙伴解决方案

开发者社区