ESD178-B1-W0201
现货，推荐
符合RoHS标准
无铅

ESD178-B1-W0201

Bi-directional ESD protection device, 1 V, 0.21 pF, 0201
数据手册
封装

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ESD178-B1-W0201
ESD178-B1-W0201
数据手册

商品详情

  • CL
    0.21 pF
  • IEFT
    40 A
  • IPP
    5 A
  • IR
    40 nA
  • Rdyn
    0.27 Ω
  • Vcl typ. reverse (@16A)
    6.6 V
  • Vcl typ. reverse (TLP 30A)
    12.8 V
  • VWM
    1 V
  • 保护线路
    1
  • 环保认证
    Halogen free, RoHS compliant
推荐的
OPN
ESD178B1W0201E6327XTSA1
产品状态 active and preferred
英飞凌封装名称
SG-WLL-2
封装名 N/A
封装尺寸 15000
封装类型 TAPE & REEL
湿度 1
防潮封装 NON DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes

产品状态
Active
英飞凌封装名称
SG-WLL-2
封装名 -
封装尺寸 15000
封装类型 TAPE & REEL
湿度 1
防潮封装 NON DRY
无铅
无卤素
符合 RoHS 标准
This Infineon ESD (electrostatic discharge) protection device has a bi-directional and symmetric I/V characteristic and excellent clamping performance.

特性

  • ESD / transient protection of high-speed data lines exceeding: IEC61000-4-2 (ESD): ±15 kV (air) / ±15 kV (contact), IEC61000-4-4 (EFT): ±2 kV / ±40 A (5/50 ns), IEC61000-4-5 (Surge): ±5 A (8/20 μs)
  • Bi-directional maximum working voltage: VWM = ±1 V
  • Diode type I/V characteristic with Vbr = 1.5 V at 1 mA
  • Line capacitance: CL = 0.21 pF at f = 5 GHz
  • Clamping voltage: VCL = 4.5 V at ITLP = 8 A with Rdyn = 0.27 Ω
  • Low leakage current: IL = 40 nA
  • Small form factor SMD size, low profile (0.58 x 0.28 x 0.15 mm³)

产品优势

  • Low insertion loss
  • Low clamping
  • Bi-directional protection device
  • Small package

应用

文档

设计资源

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