现货，推荐
符合RoHS标准

F3L11MR12W2M1_B74

CoolSiC™ MOSFET 3-level module 1200 V
数据手册
每件.
有存货

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F3L11MR12W2M1_B74
F3L11MR12W2M1_B74
每件.
数据手册

商品详情

  • RDS (on) (@ Tj = 25°C)
    11.3 mΩ
  • Housing
    Easy 2B
  • Dimensions (length)
    62.8 mm
  • Dimensions (width)
    48 mm
  • Applications
    ESS, Solar, EV Charger
  • Features
    PressFIT, phase leg
  • Qualification
    Industrial
  • Configuration
    3-Level
受到推崇的
OPN
F3L11MR12W2M1B74BOMA1
产品状态 active and preferred
英飞凌封装名称 AG-EASY2B
封装名 N/A
包装尺寸 15
包装类型 TRAY
湿度 NA
防潮包装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 Yes
Infineon stock last updated:
 每件. 有存货

产品状态
Active
英飞凌封装名称 AG-EASY2B
封装名 -
包装尺寸 15
包装类型 TRAY
湿度 NA
防潮包装 NON DRY
无铅
无卤素
符合 RoHS 标准
每件.
有存货
EasyPACK™ 2B CoolSiC™ MOSFET 3-level module in ANPC topology 1200 V, 11mΩ G1 with NTC and PressFIT contact technology.

特性

  • Best-in-class packages with 12 mm height
  • Leading edge WBG material
  • Very low module stray inductance
  • Enhanced CoolSiC™ MOSFET Gen 1
  • Enlarged gate drive voltage window
  • Gate-source voltages of +20 V and -10 V
  • PressFIT pins
  • Integrated NTC temperature sensor

产品优势

  • Outstanding module efficiency
  • System cost advantages
  • System efficiency improvement
  • Reduced cooling requirements
  • Enabling higher frequency
  • Increase of power density

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