F3L6MXTR23C2M2Q_H70
新品
现货，推荐
符合RoHS标准

F3L6MXTR23C2M2Q_H70

新品
EasyPACK™ 2C CoolSiC™ MOSFET 2300 V M2 .XT 3-level module
数据手册

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F3L6MXTR23C2M2Q_H70
F3L6MXTR23C2M2Q_H70
数据手册


商品详情


推荐的
OPN
F3L6MXTR23C2M2QH70BPSA1
产品状态 active and preferred
英飞凌封装名称 AG-EASY2C
封装名 N/A
封装尺寸 18
封装类型 TRAY
湿度 NA
防潮封装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 Yes
封装产地
DE
晶圆产地
AT

产品状态
Active
英飞凌封装名称 AG-EASY2C
封装名 -
封装尺寸 18
封装类型 TRAY
湿度 NA
防潮封装 NON DRY
无铅
无卤素
符合 RoHS 标准
封装产地
DE
晶圆产地
AT
EasyPACK™ 2C CoolSiC™ MOSFET M2 3-level module 2300 V, 6 mΩ with NTC, high current PressFIT and .XT technologies, pre-applied TIM 2.0

特性

  • VDSS = 2300 V
  • IDN = 120 A / IDRM = 240 A
  • Overload operation up to 175°C
  • AlN substrate
  • High creepage and clearance distances
  • Integrated NTC temperature sensor
  • PressFIT contact technology

产品优势

  • Outstanding module efficiency
  • System efficiency improvement
  • Enhanced lifetime
  • High temperature withstand capability
  • Reduction of static losses
  • Compact design
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