FF2MR08C2M2_H11_A
新品
现货，推荐
符合RoHS标准

FF2MR08C2M2_H11_A

新品
CoolSiC™ MOSFET half-bridge module 750 V

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FF2MR08C2M2_H11_A
FF2MR08C2M2_H11_A


商品详情


推荐的
OPN
FF2MR08C2M2H11ABPSA1
产品状态 active and preferred
英飞凌封装名称 AG-EASY2C
封装名 N/A
封装尺寸 15
封装类型 TRAY
湿度 NA
防潮封装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 Yes
封装产地
DE
晶圆产地
AT

产品状态
Active
英飞凌封装名称 AG-EASY2C
封装名 -
封装尺寸 15
封装类型 TRAY
湿度 NA
防潮封装 NON DRY
无铅
无卤素
符合 RoHS 标准
封装产地
DE
晶圆产地
AT
EasyPACK™ 2C CoolSiC™ Trench MOSFET half-bridge module 750 V, 2mΩ G2 with NTC, high-current PressFIT contact technology, AQG 32

特性

  • VDSS = 750 V
  • IDN = 240 A / IDRM = 720 A
  • Low inductive design
  • Low switching losses
  • High current density
  • PressFIT contact technology
  • Integrated NTC temperature sensor
  • Rugged mounting with integrated clamps
  • Package with CTI > 600
  • High current pin

产品优势

  • Outstanding module efficiency
  • System efficiency improvement
  • Long lifetime
  • High temperature with stand capability
  • Reduction of static losses
  • Compact design
  • Full compability to Easy Pack B™
  • Automotive qualified
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