新品
现货,推荐
符合RoHS标准
无铅

FS1000R08A7P3B

新品
The HybridPACK™ Drive is a very compact six-pack module (750V/1000A) optimized for hybrid and electric vehicles.

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FS1000R08A7P3B
FS1000R08A7P3B

商品详情

  • IC(nom) / IF(nom)
    600 A
  • VCES
    750 V
  • Housing
    HybridPACK™ Drive G2
  • Technology
    IGBT EDT3
  • Launch year
    2025
  • Features
    PinFin Base Plate
  • Currently planned availability until at least
    2035
  • Configuration
    Sixpack
OPN
FS1000R08A7P3BHPSA1
产品状态 active and preferred
英飞凌封装名称 AG-HDG2XT-7611
封装名 N/A
包装尺寸 6
包装类型 TRAY
湿度 NA
防潮包装 NON DRY
无铅 Yes
无卤素 No
符合RoHS标准 Yes
Infineon stock last updated:

产品状态
Active
英飞凌封装名称 AG-HDG2XT-7611
封装名 -
包装尺寸 6
包装类型 TRAY
湿度 NA
防潮包装 NON DRY
无铅
无卤素
符合 RoHS 标准
The power module implements Infineon’s next generation chip technology EDT3 750V, optimized for electric drive train applications, from mid- to high-range automotive power classes.

特性

  • VCES = 750 V
  • ICN = 1000 A / ICRM = 2000 A
  • Low VCE,sat
  • Low switching losses
  • Low Qg and Crss
  • Low inductive design
  • Tvj,op = 175°C
  • Integrated on-chip temperature sensor
  • Short-term temp up to 185°C
  • Direct-cooled PinFin base plate
  • PCB and cooler assembly guides
  • PressFIT contact technology

产品优势

  • Higher temperature cycling capability
  • Integrated diode temperature sensors
  • New plastic material
  • Better temperature capability
  • New frame design for lower system BOM
  • Lower AC contact resistance and tab temp
  • PressFIT Contact Technology
  • RoHS compliant
  • Completely Pb free
  • Superior reliability

应用

文档

设计资源

开发者社区

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