现货，推荐
符合RoHS标准
无铅

S27KL0643DPBHV023

数据手册
封装

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S27KL0643DPBHV023
S27KL0643DPBHV023
数据手册

商品详情

  • Initial Access Time
    36 ns
  • Density
    64 MBit
  • Peak Reflow Temp
    260 °C
  • Operating Temperature
    -40 °C to 105 °C
  • Operating Voltage
    3 V
  • Lead Ball Finish
    N/A
  • Technology
    HYPERRAM
  • Interface Bandwidth
    333 MByte/s
  • Interfaces
    xSPI (Octal)
  • Interface Frequency (SDR/DDR) (MHz)
    - / 166
  • Family
    KL-3
  • Currently planned availability until at least
    2031
  • Qualification
    Industrial
受到推崇的
OPN
S27KL0643DPBHV023
产品状态 active and preferred
英飞凌封装名称
PG-BGA-24
封装名 FBGA-24 (002-15550)
包装尺寸 2500
包装类型 TAPE & REEL
湿度 3
防潮包装 DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes
Infineon stock last updated:

产品状态
Active
英飞凌封装名称
PG-BGA-24
封装名 FBGA-24 (002-15550)
包装尺寸 2500
包装类型 TAPE & REEL
湿度 3
防潮包装 DRY
无铅
无卤素
符合 RoHS 标准

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