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Reliability of PressFIT connections

PressFIT is a force fitting technology for power semiconductor modules, which offers these possibilities. Such technology is well known as a highly reliable connection for several years in the industry, in telecommunications and in automotive designs. But for high current frequency controlled inverters, this technology is new. To take into account the application specific requirements, we modify common reliability test procedures for power modules and PressFIT connections. The data are analysed with special focus on the electrical resistance after climatic, vibration and temperature loads. The conclusion of all tests is that the reliability of the PressFIT technology is superior and also well suited for power semiconductor modules. One of the crucial questions for PressFIT technologies is the one for the contact material and geometry providing large enough force to remove corrosion layers and guarantee sufficiently high holding forces, providing enough flexibility not to destroy the contacted PCB, tolerating manufacturing tolerances for conventional PCB holes (vias), and providing sufficiently large current capability. Due to this, two PressFIT designs with flexible force fitting geometries have been developed.

• 472.27 KB
• 06/06/2008