现货，推荐

5962F1120202VXA

数据手册
封装

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5962F1120202VXA
5962F1120202VXA
数据手册

商品详情

  • ECC
    N
  • Density
    72 MBit
  • Peak Reflow Temp
    220 °C
  • Operating Temperature
    -55 °C to 125 °C
  • Operating Voltage
    1.7 V to 1.9 V
  • Lead Ball Finish
    Sn/Pb
  • Interfaces
    Parallel
  • Data Width
    x 36
  • Architecture
    QDR-II+
  • On-Die Termination
    N
  • Family
    QDR-II+
  • Organization (X x Y)
    2Mb x 36
  • Burst Length (Words)
    4
  • Currently planned availability until at least
    2033
  • Qualification
    Military
  • Device weight
    6152.8 mg
  • Read Latency (Cycles)
    2
  • Bank Switching
    N
  • Frequency
    250 MHz
受到推崇的
OPN
5962F1120202VXA
产品状态 active and preferred
英飞凌封装名称
C-CGA-165
封装名 CCGA-165 (001-58969)
包装尺寸 1
包装类型 TRAY
湿度 1
防潮包装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 No
Infineon stock last updated:

产品状态
Active
英飞凌封装名称
C-CGA-165
封装名 CCGA-165 (001-58969)
包装尺寸 1
包装类型 TRAY
湿度 1
防潮包装 NON DRY
无铅
无卤素
符合 RoHS 标准

应用

文档

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{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "向社区提问", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "查看所有讨论", "labelEn" : "View all discussions" } ] }