现货，推荐

CY7C1470BV33-167BZI

数据手册
封装

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CY7C1470BV33-167BZI
CY7C1470BV33-167BZI
数据手册

商品详情

  • ECC
    N
  • Density
    72 MBit
  • Peak Reflow Temp
    220 °C
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    3.14 V to 3.63 V
  • Lead Ball Finish
    Sn/Pb
  • Interfaces
    Parallel
  • Data Width
    x 36
  • Architecture
    NoBL, Pipeline
  • On-Die Termination
    N
  • Family
    NoBL
  • Organization (X x Y)
    2Mb x 36
  • Qualification
    Industrial
  • Read Latency (Cycles)
    1
  • Bank Switching
    N
  • Frequency
    167 MHz
受到推崇的
OPN
CY7C1470BV33-167BZI
产品状态 active and preferred
英飞凌封装名称
P -BGA-165
封装名 FBGA-165 (51-85165)
包装尺寸 210
包装类型 TRAY
湿度 3
防潮包装 DRY
无铅 No
无卤素 No
符合RoHS标准 No
Infineon stock last updated:

产品状态
Active
英飞凌封装名称
P -BGA-165
封装名 FBGA-165 (51-85165)
包装尺寸 210
包装类型 TRAY
湿度 3
防潮包装 DRY
无铅
无卤素
符合 RoHS 标准

应用

文档

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{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "向社区提问", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "查看所有讨论", "labelEn" : "View all discussions" } ] }