现货，推荐
符合RoHS标准

CY7C2644KV18-333BZXI

数据手册
封装

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CY7C2644KV18-333BZXI
CY7C2644KV18-333BZXI
数据手册

商品详情

  • ECC
    N
  • Density
    144 MBit
  • Peak Reflow Temp
    260 °C
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    1.7 V to 1.9 V
  • Lead Ball Finish
    Sn/Ag/Cu
  • Interfaces
    Parallel
  • Data Width
    x 36
  • Architecture
    QDR-II+, ODT
  • On-Die Termination
    Y
  • Family
    QDR-II+, ODT
  • Organization (X x Y)
    4Mb x 36
  • Burst Length (Words)
    2
  • Qualification
    Industrial
  • Read Latency (Cycles)
    2.5
  • Bank Switching
    N
  • Frequency
    333 MHz
受到推崇的
OPN
CY7C2644KV18-333BZXI
产品状态 active and preferred
英飞凌封装名称
PG-BGA-165
封装名 FBGA-165 (51-85195)
包装尺寸 210
包装类型 TRAY
湿度 3
防潮包装 DRY
无铅 No
无卤素 No
符合RoHS标准 Yes
Infineon stock last updated:

产品状态
Active
英飞凌封装名称
PG-BGA-165
封装名 FBGA-165 (51-85195)
包装尺寸 210
包装类型 TRAY
湿度 3
防潮包装 DRY
无铅
无卤素
符合 RoHS 标准

应用

文档

文档

设计资源

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开发者社区

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