F4-17MXTR33C2M1_H72
新品
现货，推荐
符合RoHS标准

F4-17MXTR33C2M1_H72

新品
EasyPACK™ 2C CoolSiC™ MOSFET 3300 V M1H .XT fourpack module

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F4-17MXTR33C2M1_H72
F4-17MXTR33C2M1_H72


商品详情

  • RDS (on) (@ Tj = 25°C)
    16.6 mΩ
  • 封装
    EasyPACK™ 2C
  • 尺寸 (width)
    62.8 mm
  • 尺寸 (length)
    57.1 mm
  • 应用
    ESS, EV-Charging, Photovoltaic, Fourpack, DC-DC Converter
  • 拓扑结构
    Fourpack
  • 特性
    PressFIT
  • 质量等级
    Industrial

推荐的
OPN
F417MXTR33C2M1H72BPSA1
产品状态 active and preferred
英飞凌封装名称 AG-EASY2C
封装名 N/A
封装尺寸 15
封装类型 TRAY
湿度 NA
防潮封装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 Yes
封装产地
DE
晶圆产地
AT

产品状态
Active
英飞凌封装名称 AG-EASY2C
封装名 -
封装尺寸 15
封装类型 TRAY
湿度 NA
防潮封装 NON DRY
无铅
无卤素
符合 RoHS 标准
封装产地
DE
晶圆产地
AT
EasyPACK™ 2C CoolSiC™ MOSFET M1H fourpack module 3300 V, 17 mΩ with NTC, high current PressFIT and .XT technologies.

特性

  • VDSS = 3300 V
  • IDN = 120 A / IDRM = 300 A
  • Low inductive design
  • Low switching losses
  • High current density
  • Silicon carbide MOSFET with .XT
  • PressFIT contact technology
  • Integrated NTC
  • AlN substrate
  • Package with CTI > 600
  • High current pin
  • High power cycling capability

产品优势

  • Outstanding module efficiency
  • System efficiency improvement
  • Enhanced lifetime
  • High temperature withstand capability
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