现货，推荐

S70FL01GSAGBAEC13

数据手册
封装
软件

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S70FL01GSAGBAEC13
S70FL01GSAGBAEC13
数据手册

商品详情

  • Density
    1 GBit
  • Peak Reflow Temp
    220 °C
  • Operating Temperature
    -55 °C to 125 °C
  • Operating Voltage
    3 V
  • Lead Ball Finish
    Sn/Pb
  • Interface Bandwidth
    66 MByte/s
  • Interfaces
    Quad SPI
  • Interface Frequency (SDR/DDR) (MHz)
    133 / -
  • Family
    FL-S
  • Currently planned availability until at least
    2033
  • Qualification
    Military
受到推崇的
OPN
S70FL01GSAGBAEC13
产品状态 active and preferred
英飞凌封装名称
P-TFBGA-24
封装名 FBGA-24 (002-15078)
包装尺寸 2500
包装类型 TAPE & REEL
湿度 3
防潮包装 DRY
无铅 No
无卤素 Yes
符合RoHS标准 No
Infineon stock last updated:

产品状态
Active
英飞凌封装名称
P-TFBGA-24
封装名 FBGA-24 (002-15078)
包装尺寸 2500
包装类型 TAPE & REEL
湿度 3
防潮包装 DRY
无铅
无卤素
符合 RoHS 标准

应用

文档

文档

设计资源

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开发者社区

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "向社区提问", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "查看所有讨论", "labelEn" : "View all discussions" } ] }