现货，推荐
符合RoHS标准

S70KL1282GABHI020

数据手册
封装

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S70KL1282GABHI020
S70KL1282GABHI020
数据手册

商品详情

  • Initial Access Time
    35 ns
  • Density
    128 MBit
  • Peak Reflow Temp
    260 °C
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    3 V
  • Lead Ball Finish
    N/A
  • Technology
    HYPERRAM
  • Interface Bandwidth
    400 MByte/s
  • Interfaces
    HYPERBUS
  • Interface Frequency (SDR/DDR) (MHz)
    - / 200
  • Family
    KL-2
  • Currently planned availability until at least
    2031
  • Qualification
    Industrial
受到推崇的
OPN
S70KL1282GABHI020
产品状态 active and preferred
英飞凌封装名称
PG-BGA-24
封装名 BGA-24 (002-15550)
包装尺寸 3380
包装类型 TRAY
湿度 3
防潮包装 DRY
无铅 No
无卤素 No
符合RoHS标准 Yes
Infineon stock last updated:

产品状态
Active
英飞凌封装名称
PG-BGA-24
封装名 BGA-24 (002-15550)
包装尺寸 3380
包装类型 TRAY
湿度 3
防潮包装 DRY
无铅
无卤素
符合 RoHS 标准

应用

文档

文档

设计资源

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开发者社区

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