- ASIC
- 电池管理 IC
- 时钟和时序解决方案
- ESD 和浪涌保护器件
- Automotive Ethernet
- 评估板
- 高可靠性
- 隔离
- 存储器
- 微控制器
- 功率产品
- 射频
- 安全智能卡解决方案
- 传感器技术
- 小信号晶体管和二极管
- 收发器
- 通用串行总线(USB)
- 无线连接
- 英飞凌大中华区生态圈
- 搜索工具
- 技术
- 封装
- 购买渠道
- 概览
- Automotive Ethernet Bridges
- Automotive Ethernet PHY for in-vehicle networking
- Automotive Ethernet Switches for in-vehicle networking
- 概览
- 嵌入式闪存eFlash IP 解决方案
- RAM和Flash多芯片封装MCP解决方案
- F-RAM铁电存储器
- NOR 闪存
- nvsRAM非易失性存储器
- PSRAM伪静态随机存储器
- 抗辐射和高可靠性的存储器
- RRAM阻变存储器
- SRAM静态随机存储器
- 晶圆和裸片存储器解决方案
- 概览
- AC-DC电源转换
- 电动汽车动力系统
- D 类音频放大器 IC
- 非接触式电源和检测 IC
- DC-DC 转换器
- 二极管&晶闸管 (Si/SiC)
- 氮化镓(GaN)
- GaN EiceDRIVER™高速栅极驱动器
- IGBT 产品及驱动器件
- 智能功率模块(IPM)
- LED 驱动芯片
- 电机控制 IC 和驱动
- 高效能功率MOSFET 和 MOS管
- Power modules
- 电源模块
- 保护和监控IC
- Silicon carbide (SiC)
- 智能电源开关
- 固态继电器
- 无线充电 IC
- 概览
- Calypso® 产品
- CIPURSE™ 产品
- 非接触式存储
- 了解 OPTIGA™ 嵌入式加密解决方案
- SECORA™ 安全解决方案
- 安全控制器
- 智能卡模块
- 政府身份证的智能解决方案
- 概览
- REAL3™ 3D ToF 图像传感器
- MOTIX™ MCU (SoC) 基于 Arm® Cortex®-M0,集成半桥驱动器
- 气体传感器
- Inductive position sensors
- 微机电系统麦克风
- 压力传感器
- 雷达传感器
- 磁性位置传感器
- 磁性速度传感器
- 概览
- USB 2.0 外设控制器
- USB 3.2 外设控制器
- USB 集线器控制器
- USB PD 高压微控制器
- USB-C AC-DC 和 DC-DC 充电解决方案
- USB-C 充电端口控制器
- USB-C 供电控制器
- 概览
- AIROC™ 车载无线
- AIROC™ 蓝牙Bluetooth® 和多协议解决方案
- AIROC™ 互联微控制器
- AIROC™ Wi-Fi + Bluetooth® 组合
- 概览
- FM0+ 32 位 Arm® Cortex-M0®+ 微控制器 (MCU) 系列
-
FM3 32 位 Arm® Cortex-M3® 微控制器 (MCU) 系列
- 概览
- FM3 CY9AFx1xK 系列 Arm® Cortex-M3® 微控制器 (MCU)
- FM3 CY9AFx1xL/M/N 系列 Arm® Cortex-M3® 微控制器 (MCU)
- FM3 CY9AFx2xK/L 系列 Arm® Cortex-M3® 微控制器 (MCU)
- FM3 CY9AFx3xK/L 系列超低漏电流 Arm® Cortex-M3® 微控制器 (MCU)
- FM3 CY9AFx4xL/M/N 系列低功耗 Arm® Cortex-M3® 微控制器 (MCU)
- FM3 CY9AFx5xM/N/R 系列低功耗 Arm® Cortex-M3® 微控制器 (MCU)
- FM3 CY9AFxAxL/M/N 系列超低漏电流 Arm® Cortex-M3® 微控制器 (MCU)
- FM3 CY9BFx1xN/R 高性能系列 Arm® Cortex-M3® 微控制器 (MCU)
- FM3 CY9BFx1xS/T 高性能系列 Arm® Cortex-M3® 微控制器 (MCU)
- FM3 CY9BFx2xJ 系列 Arm® Cortex-M3®微控制器 (MCU)
- FM3 CY9BFx2xK/L/M 系列 Arm® Cortex-M3® 微控制器 (MCU)
- FM3 CY9BFx2xS/T 系列 Arm® Cortex-M3® 微控制器 (MCU)
- FM4 32 位 Arm® Cortex-M4® 微控制器 (MCU) 系列
- 概览
-
TriCore™ AURIX™ TC2x安全模块
- 概览
- AURIX™系列 – TC21xL
- AURIX™ 系列 – TC21xSC (无线充电)
- AURIX™ 系列 – TC22xL
- AURIX™系列 – TC23xL
- AURIX™ 系列 – TC23xLA (ADAS)
- AURIX™ 系列 – TC23xLX
- AURIX™ 系列 – TC264DA (ADAS)
- AURIX™系列 – TC26xD
- AURIX™ 系列 – TC27xT
- AURIX™ 系列 – TC297TA (ADAS)
- AURIX™ 系列 – TC29xT
- AURIX™ 系列 – TC29xTT (ADAS)
- AURIX™系列 – TC29xTX
- AURIX™ TC2x仿真器件
- 32 位TriCore™ AURIX™ – TC3x
- 32 位TriCore™ AURIX™ - TC4x
- 概览
- PSOC™ 4 Arm® Cortex®-M0/M0+
- PSOC™ 4 HV Arm® Cortex®-M0+
- PSOC™ 5 LP Arm® Cortex®-M3
- PSOC™ 6 Arm® Cortex-M4®/M0+
- PSOC™ Multitouch Arm® Cortex®-M0
- 32 位 PSOC ™ Control Arm® Cortex ® -M33 MCU
- PSOC™ Fingerprint Arm® Cortex®-M0+
- PSOC™ Automotive 4: Arm® Cortex®-M0/M0+
- PSOC™ Edge Arm® Cortex® M55/M33
- 概览
- 32 位 TRAVEO™ T2G Arm® Cortex®用于车身电子应用
- 用于仪表盘的 32 位 TRAVEO™ T2G Arm® Cortex®
- 概览
- 32 位XMC1000工业微控制器 Arm® Cortex-M0®
- 32 位XMC4000工业微控制器 Arm® Cortex-M4®
- XMC5000 Industrial Microcontroller Arm® Cortex®-M4F
- 32 位XMC7000工业微控制器 Arm® Cortex-M7®
- 概览
- 桥式整流器和交流开关
- CoolSiC™ 肖特基二极管
- 二极管裸片
- 硅二极管
- 晶闸管/二极管模块
- 晶闸管软启动器模块
- 晶闸管/二极管盘
- 概览
- 32-bit PSOC™ Control Arm® Cortex®-M33 MCU
- iMOTION™集成电机控制解决方案
- Embedded Power ICs (System-on-Chip) -146
- MOTIX™电机控制IC用于BLDC电机
- MOTIX™ 电机控制IC,用于有刷直流电机
- MOTIX™ 多半桥IC用于伺服和步进电机
- 概览
- 汽车级MOSFET
- 双 MOSFET
- MOSFET(Si 和 SiC)模块
- N 沟道耗尽型 MOSFET
- N沟道MOS管
- 碳化硅 CoolSiC™ MOSFET
- 250V至600V G14小信号MOS
- 概览
- OPTIGA™ Authenticate
- OPTIGA™ Authenticate NFC 解决方案
- OPTIGA™ Connect – 交钥匙式 eSIM 安全解决方案
- OPTIGA™ Trust
- OPTIGA™ 可信平台模块 (TPM)
- 概览
- EZ-PD™ ACG1F 单端口 USB-C 控制器
- EZ-PD™ CCG2 USB Type-C 端口控制器
- EZ-PD™ CCG3PA Automotive USB-C 和 Power Delivery 控制器
- EZ-PD™ CCG4 双端口 USB-C 和 PD
- EZ-PD™ CCG5 双端口和 CCG5C 单端口 USB-C PD 控制器
- EZ-PD™ CCG6 单端口 USB-C & PD 控制器
- EZ-PD ™ CCG6_CFP 和 EZ-PD ™ CCG8_CFP 双单端口 USB-C PD
- EZ-PD™ CCG6DF 双端口和 CCG6SF 单端口 USB-C PD 控制器
- EZ-PD™ CCG7D 汽车双口 USB-C PD + DC-DC 控制器
- EZ-PD™ CCG7S 汽车单口 USB-C PD 解决方案,配备DC-DC控制器
- EZ-PD™ CCG7SAF 车规级单端口 USB-C PD + DC-DC 控制器 + FETs
- EZ-PD™ CCG8 双/单口 USB-C PD
- EZ-PD™ CMG1 USB-C EMCA 控制器
- 支持 EPR 的 EZ-PD™ CMG2 USB-C EMCA 控制器
- 最新动态
- 航空航天
- 智能汽车解决方案
- 消费类电子产品
- 健康和 生活方式
- 家用电器
- 工业
- 信息和通信技术
- 可再生能源
- 机器人
- 安全解决方案
- 智能家居和楼宇
- 解决方案
- 概览
- 适配器和充电器
- 适用于智能电视的完整系统解决方案
- 移动设备和智能手机解决方案
- 多旋翼飞机和无人机
- 电动工具
- 家庭娱乐应用的半导体解决方案
- 智能会议系统
- 概览
- 汽车辅助系统
- 车载网关
- 汽车配电系统
- 车身控制模块 (BCM)
- 舒适便捷电子产品
- 区域 DC-DC 转换器 48 V-12 V
- 区域控制器
- 概览
- 汽车车载主机
- 汽车 USB-C 电源和数据解决方案
- 汽车仪表盘
- 汽车远程信息处理控制单元 (TCU)
- 中央信息显示屏(CID)
- 高性能驾驶舱控制器
- 舱内无线充电
- 智能仪表盘(电动两轮车和三轮车)
- 最新动态
- 概览
- AIROC™ 软件&工具
- AURIX™应用软件
- Drive Core 用于汽车软件开发
- iMOTION™ 工具和软件
- Infineon智能功率开关和栅极驱动器工具套件
- MOTIX 软件&工具
- OPTIGA™工具和软件
- PSOC™ 软件&工具
- TRAVEO™ 软件&工具
- XENSIV™ 工具和软件
- XMC™ 工具和软件
- 概览
- DEEPCRAFT™ 人工智能中心
- DEEPCRAFT™ Audio Enhancement
- DEEPCRAFT™ Model Converter
-
DEEPCRAFT ™准备模型
- 概览
- DEEPCRAFT™ Ready Model for Baby Cry Detection
- DEEPCRAFT™ Ready Model for Cough Detection
- DEEPCRAFT™ Ready Model for Direction of Arrival (Sound)
- DEEPCRAFT™ Ready Model for Factory Alarm Detection
- DEEPCRAFT™ Ready Model for Fall Detection
- DEEPCRAFT™ Ready Model for Gesture Classification
- DEEPCRAFT™ Ready Model for Siren Detection
- DEEPCRAFT™ Ready Model for Snore Detection
- DEEPCRAFT ™工作室
- DEEPCRAFT™ Voice Assistant
- 概览
- EZ-PD™ CCGx Dock 软件开发工具包
- FMx Softune IDE
- ModusToolbox™ 软件
- PSOC™ Creator软件
- 雷达开发套件
- 锈
- USB 集线器控制器
- 无线连接蓝牙网状网络辅助应用程序
- XMC™ DAVE™ Software
- 最新动态
- 支持
- 培训
- 英飞凌开发者社区
- 最新消息
商业财经新闻
17/11/2025
季度报告
12/11/2025
商业财经新闻
12/11/2025
商业财经新闻
05/11/2025
- 公司名称
- 我们的故事
- 活动资讯
- 新闻中心
- 投资者
- 职业生涯
- 质量
- 最新消息
商业财经新闻
17/11/2025
季度报告
12/11/2025
商业财经新闻
12/11/2025
商业财经新闻
05/11/2025
Infineon receives building permit for final construction phase of Smart Power Fab in Dresden
Infineon receives building permit for final construction phase of Smart Power Fab in Dresden
商业财经新闻
- Saxony's Prime Minister Michael Kretschmer hands over the last outstanding building permit for the construction project
- Infineon is on schedule with the Smart Power Fab with the start of production planned for 2026
- Total investment of 5 billion euros in a state-of-the-art semiconductor manufacturing in Germany
- With the fab, Infineon is increasing supply chain security in Europe and making a significant contribution to decarbonization and digitization
Dresden, Germany – 30 May 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is on schedule with the construction of the Smart Power Fab in Dresden and is initiating the final construction phase. During a visit, the Prime Minister of the Free State of Saxony, Michael Kretschmer, officially handed over the last outstanding building permit for the new fab issued by the State Directorate of Saxony. The excavation of the building pit has now been completed. The shell and building construction are currently progressing on the concrete foundation, which is up to two meters thick. Infineon officially broke ground for the new plant in Dresden in May 2023. Manufacturing is scheduled to start in 2026. The production will focus on semiconductors that promote decarbonization and digitalization.
With a total investment of five billion euros, the company is making a significant contribution to the European Commission goal to increase the EU's share of global semiconductor production to 20 percent by 2030. The semiconductors manufactured in Dresden will secure future value chains in key European industries. The products manufactured in the new production facility will be used in the automotive and renewable energy industries. The interaction of power semiconductors and analog/mixed-signal components enables particularly energy-efficient and intelligent system solutions – hence the name Smart Power Fab.
"The construction of the Smart Power Fab is a big win for Dresden, Saxony, Germany and Europe," says Michael Kretschmer, Prime Minister of the Free State of Saxony. "Infineon's fourth production module in Dresden is another important building block in strengthening Europe's resilience in the field of microelectronics. It is a further step towards achieving the European Commission's goal of increasing Europe's share of global chip production to 20 percent. Thanks to a thoughtful cooperation between the company, the Free State of Saxony, the local authorities, and the federal government, it has been possible to get the investment off the ground and to issue the relevant permits quickly. As a result, the semiconductors that we urgently need for the mobility and energy transition can be produced in the new fab starting in 2026."
"We are making excellent progress with the construction of our state-of-the-art Smart Power Fab in Dresden. We are right on schedule also thanks to the excellent cooperation with the authorities," says Dr. Rutger Wijburg, Member of the Management Board and Chief Operations Officer of Infineon. "With our strategic decision to continue investing in Dresden, we are securing the long-term future of the site and strengthening the manufacturing base for semiconductors in Europe."
The dimensions of the construction site are impressive. On average, construction workers have removed around 8,000 tons of soil every day since the start of work. A total of 450,000 cubic meters of excavated soil has been produced, which corresponds to the volume of 180 Olympic swimming pools. The soil is being temporarily stored in a specially prepared area near the Dresden Airport freeway junction. The 22-metre-deep pit not only compensates for the natural gradient, but also provides a firm foundation for the 150- to 190-centimetre-thick base plate, which is intended to reduce vibrations – from passing streetcars, for example – to a minimum. Even minimal vibrations can affect the sensitive semiconductor production.
In the next construction phase, the basement levels will be built, along with other levels. The clean room – the heart of the Smart Power Fab – is planned for the fourth level. Once completed, it will be at the exact same height as the site's three existing production rooms. This will optimize an integrated production. The future construction phase of the project includes a total of ten tower cranes, some of them 80 meters high to support up to 1,200 construction workers who will be working on the site every day in multiple shifts.
The investment in Dresden is part of the company’s strategy to reach CO 2-neutrality by 2030. The Smart Power Fab sets new efficiency standards for the consumption of important resources such as energy and water. This has a positive impact on the carbon footprint of Infineon. Even today, Infineon's products, which are used in solar and wind power plants, reduce 34 times the amount of CO 2 emitted during their production over their lifetime.
With the investment in the new plant, Infineon is creating an additional 1,000 jobs in the Saxon state capital. The company currently employs approximately 3,250 people in Dresden. The number of trainees has already been significantly increased with the new Fab. Subject to the European Commission's state aid decision and the national grant procedure, the project is to be funded in accordance with the objectives of the European Chips Act. Infineon is aiming for public funding of around one billion euros.
Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,600 employees worldwide and generated revenue of about €16.3 billion in the 2023 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).
Press Photos
Visit of Infineon Dresden
Raik Brettschneider, Managing Director, Infineon Dresden Regina Kraushaar, President of the Saxony State Directorate Michael Kretschmer, Prime Minister of the Free State of Saxony Dr. Rutger Wijburg, Member of the Management Board and Chief Operations Officer, Infineon Technologies AG Dirk Hilbert, Mayor of Dresden Thomas Richter, Managing Director, Infineon Dresden
JPEG
2126x1266 px
Infineon's smart power fab in Dresden
Construction site of Infineon’s Smart Power Fab in Dresden
JPEG
2126x1417 px
Information Number : INFXX202405-109