HPD GD BOARD G1 SIC

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HPD GD BOARD G1 SIC
HPD GD BOARD G1 SIC
用户手册

商品详情

  • Board Type
    Evaluation Board, Reference Board
  • Product Name
    Evaluation gate driver board for HybridPACK™ Drive CoolSiC™
  • Applications
    Automotive SiC Modules
  • Topology
    B6 Bridge
  • Target Application
    Automotive, Motor Control & Drives, Electromobility, E-Bikes & Small E-Vehicles
  • Family
    SiC Modules
  • Qualification
    Automotive
OPN
产品状态
英飞凌封装名称
封装名
包装尺寸
包装类型
湿度
防潮包装
无铅
无卤素
符合RoHS标准
Infineon stock last updated:
EiceDRIVER ™隔离六通道栅极驱动器板，适用于 HybridPACK ™ Drive CoolSiC ™汽车电源模块（FS03MR12A6MA1B、FS03MR12A6MA1LB、FS05MR12A6MA1B）。

产品优势

  • 节省设计时间
  • 实现 SiC 模块的快速评估

应用

Bill of Material

文档

文档

设计资源

合作伙伴解决方案

开发者社区

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