KIT_IM66D130MV01_FLEX
现货，推荐
符合RoHS标准

KIT_IM66D130MV01_FLEX

Five XENSIV™ MEMS microphones mounted on flex board and one adapter board

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KIT_IM66D130MV01_FLEX
KIT_IM66D130MV01_FLEX
推荐的
OPN
KITIM66D130MV01FLEXTOBO1
产品状态 active and preferred
英飞凌封装名称 N/A
封装名 N/A
封装尺寸 1
封装类型 CONTAINER
湿度 NA
防潮封装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 Yes

产品状态
Active
英飞凌封装名称 N/A
封装名 -
封装尺寸 1
封装类型 CONTAINER
湿度 NA
防潮封装 NON DRY
无铅
无卤素
符合 RoHS 标准
The flex evaluation kits allow simple and easy evaluation of XENSIV™ MEMS microphones. One microphone of the respective type is mounted on each flex board. A flex board can be easily connected to an audio testing setup with the included adapter board via a 6-position ZIF connector. Each kit includes five flex boards and one adapter board.

特性

  • Quick connection to evaluation system
  • Small size: 25 mm x 4.5 mm
  • Pre-soldered MEMS microphone

应用

Bill of Material

文档

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