IDSQ50G120C5D
即将推出
即将推出
符合RoHS标准
无铅

IDSQ50G120C5D

CoolSiC™ 1200 V Schottky diode G5 in top side cooled Q-DPAK dual die-pad package
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封装

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IDSQ50G120C5D
IDSQ50G120C5D
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商品详情


OPN
IDSQ50G120C5DXUMA1
产品状态 coming soon
英飞凌封装名称
PG-HDSOP-16
封装名 N/A
封装尺寸 750
封装类型 TAPE & REEL
湿度 2
防潮封装 DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes
封装产地
MY
晶圆产地
AT

产品状态 coming soon
英飞凌封装名称
PG-HDSOP-16
封装名 -
封装尺寸 750
封装类型 TAPE & REEL
湿度 2
防潮封装 DRY
无铅
无卤素
符合 RoHS 标准
封装产地
MY
晶圆产地
AT
CoolSiC™ Schottky diode 1200 V, 50 A G5 in a top-side cooled Q-DPAK package for EV charging, commercial lighting, and power supplies. The Q-DPAK package enables lower system cost, simplified assembly, and excellent thermal performance. Combined with proven CoolSiC™ technology, the top-side cooled dual die-pad design delivers higher efficiency, increased power density, improved thermal management, and greater design flexibility.

特性

  • VRRM = 1200 V
  • IF = 50 A
  • No reverse recovery current
  • No forward recovery
  • High surge current capability
  • Temp. independent switching behavior
  • Low forward voltage
  • dv/dt ruggedness
  • Pb-free lead plating
  • RoHS compliant
  • .XT interconnection technology

产品优势

  • Higher power density
  • Enabling automated assembly
  • Less complex designs needed
  • Outstanding thermal performance vs BSC
  • Improve system power losses
  • Enable a VRMS of 950 V with PD 2
  • Lower BOM cost
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