Background for document preview
Background for thumbnail

TO-leaded topside-cooled (TOLT) package power MOSFET

This document is intended as an introduction to Infineon’s topside-cooled TOLT package. The main advantages of this new package include an increased power density for high power automotive applications as well as reduced PCB temperatures thanks to decoupling the heat transfer from the current flow. In this document the package concept, thermal performance as well as the board-level reliability of the TOLT are discussed.

•
2.38 MB
•
26/04/2021