CY62126EV30LL-55BVXET
现货,推荐
符合RoHS标准
无铅

CY62126EV30LL-55BVXET

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CY62126EV30LL-55BVXET
CY62126EV30LL-55BVXET


商品详情

  • 密度
    1 MBit
  • 峰值回流温度
    260 °C
  • 工作温度 范围
    -40 °C 至 125 °C
  • 最高 工作电压 (VCCQ)
    3.6 V
  • 工作电压 范围
    2.2 V 至 3.6 V
  • 引线球表面
    Sn/Ag/Cu
  • 接口
    Parallel
  • 系列
    MoBL™ SRAM
  • 组织(X x Y)
    64K x 16
  • 质量等级
    Automotive
  • 速度
    55 ns

OPN
CY62126EV30LL-55BVXET
产品状态 active and preferred
英飞凌封装名称
封装名 VFBGA-48 (51-85150)
封装尺寸 2000
封装类型 TAPE & REEL
湿度 3
防潮封装 DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes
封装产地
TW
晶圆产地
US

产品状态
Active
英飞凌封装名称
封装名 VFBGA-48 (51-85150)
封装尺寸 2000
封装类型 TAPE & REEL
湿度 3
防潮封装 DRY
无铅
无卤素
符合 RoHS 标准
封装产地
TW
晶圆产地
US
CY62126EV30LL-55BVXET is a 1-Mbit (64K × 16) CMOS asynchronous SRAM for 2.2 V to 3.6 V systems. The Automotive-E speed bin supports 55 ns access over –40°C to +125°C. Low-power operation includes 1 µA typical standby, 30 µA max CE power-down (ISB2), and 4.0 mA max active current at 1 MHz. It supports byte writes via BLE/BHE and a High-Z output when deselected, in a 48-ball Pb-free VFBGA.

特性

  • 1-Mbit SRAM organized as 64K × 16
  • 45 ns read/write cycle time
  • 2.2 V to 3.6 V single-supply VCC
  • 1.3 mA typ active at 1 MHz
  • 4 µA max standby current
  • Auto power-down when addr static
  • Data retention at VCC down to 1.5 V
  • 3 µA max data-retention current
  • Byte write via BLE/BHE controls
  • Tri-state I/O via CE/OE/BHE/BLE

产品优势

  • 16-bit bus cuts MCU accesses
  • 45 ns suits fast SRAM interfaces
  • 2.2–3.6 V fits 3 V systems
  • Low active current extends runtime
  • µA standby minimizes sleep drain
  • Auto power-down saves idle power
  • 1.5 V retain data in deep sleep
  • Low ICCDR reduces backup load
  • Byte writes reduce write energy
  • Tri-state eases bus sharing/expand

应用

文档

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