现货，推荐
符合RoHS标准

FF1000UXTR23T2M1P

CoolSiC™ MOSFET half-bridge module 2300 V
数据手册

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FF1000UXTR23T2M1P
FF1000UXTR23T2M1P
数据手册

商品详情

  • RDS (on) (@ Tj = 25°C)
    0.95 mΩ
  • 封装
    XHP™ 2
  • 尺寸 (length)
    140 mm
  • 尺寸 (width)
    100 mm
  • 应用
    Renewables, ESS, H2, Traction
  • 特性
    .XT interconnection technology, TIM
  • 认证标准
    Traction, Industrial
  • 配置
    Half-bridge
推荐的
OPN
FF1000UXTR23T2M1PBPSA1
产品状态 active and preferred
英飞凌封装名称 AG-XHP2K23
封装名 N/A
包装尺寸 4
包装类型 TRAY
湿度 NA
防潮包装 NON DRY
无铅 No
无卤素 No
符合RoHS标准 Yes
Infineon stock last updated:

产品状态
Active
英飞凌封装名称 AG-XHP2K23
封装名 -
包装尺寸 4
包装类型 TRAY
湿度 NA
防潮包装 NON DRY
无铅
无卤素
符合 RoHS 标准
XHP™ 2 CoolSiC™ MOSFET 2300 V, 1.3 mΩ module with halfbridge topology, robust .XT interconnection technology for enhanced lifetime with best in class reliability and with pre-applied Thermal Interface Material (TIM).

特性

  • Integrated body diode
  • 2000 A Inom
  • Low-inductive housing XHP™ 2
  • .XT interconnection technology
  • Symmetrical module design
  • Lowest switching and conduction losses
  • Tvj,op = 175°C continuous
  • 4 kV isolation voltage
  • Cu baseplate

产品优势

  • Energy efficiency
  • High power density
  • Extended lifetime
  • Best in class reliability

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