AIM12S25EB1
新品
现货，推荐
符合RoHS标准
无铅

AIM12S25EB1

新品
CIPOS™ Maxi 1200 V, 45 A, three-phase Intelligent Power Module
数据手册

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AIM12S25EB1
AIM12S25EB1
数据手册


商品详情

  • Pmot (10kHz)
    14.1 kW
  • 产品名称
    AIM12S25EB1
  • 产品类别
    Intelligent Power Modules (IPM)
  • 产品组
    CIPOS™ Maxi
  • 其他信息
    Electrical
  • 内置NTC
    Yes
  • 加密
    No
  • 开关器件类型
    CoolSiC™
  • 拓扑结构
    3 Phase Open Emitter
  • 电压等级
    1200 V
  • 语言
    PLECS
  • 质量等级
    Automotive
  • 额定电流
    45 A

推荐的
OPN
AIM12S25EB1XKMA1
产品状态 active and preferred
英飞凌封装名称 N/A
封装名 DIP 36x23DA
封装尺寸 280
封装类型 TUBE
湿度 NA
防潮封装 NON DRY
无铅 Yes
无卤素 Yes
符合RoHS标准 Yes
封装产地
KR
晶圆产地
MY

产品状态
Active
英飞凌封装名称 N/A
封装名 DIP 36x23DA
封装尺寸 280
封装类型 TUBE
湿度 NA
防潮封装 NON DRY
无铅
无卤素
符合 RoHS 标准
封装产地
KR
晶圆产地
MY
CIPOS™ Maxi, 1200 V, 10 A, three-phase CoolSiC™ MOSFET based intelligent power module with open emitter in DIP 36x23 package, providing fully-featured compact inverter solution with excellent thermal conduction for motor drives applications including industrial drives, fans and pumps, HVAC, active filters, and ect.

特性

  • Smallest 1200 V IPM package
  • Compact industrial \\\& auto design
  • IGBT4, IGBT7, SiC G1/G2 options
  • Up to 15 kW with SiC G2
  • Power scaling, same footprint
  • Qualified for xEV auxiliaries
  • SiC G2 minimizes power losses
  • SOI driver with protection
  • Fewer parts, simpler PCB
  • No PCB redesign required

产品优势

  • Smallest 1200 V IPM package
  • Compact industrial \\\& auto design
  • IGBT4, IGBT7, SiC G1/G2 options
  • Up to 15 kW with SiC G2
  • Power scaling, same footprint
  • Qualified for xEV auxiliaries
  • SiC G2 minimizes power losses
  • SOI driver with protection
  • Fewer parts, simpler PCB
  • No PCB redesign required
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