PG-HDSOP-22-1

封装细节

封装材料

PG
封装系列

PG-HDSOP
端子

22
变体

1
裸露焊盘

是
本体长度 (mm)

15.0
本体宽度 (mm)

15.4
最小端子间距 (mm)

1.14

TAPE & REEL

Pieces/Box

Tubes/Box

卷盘直径 (mm)

750

1

330

Infineon heat spreader dual small outline packages (HDSOP) are offered as different variants. Alternative designation examples are double discrete package (DDPAK) for HDSOP-10, quadruple discrete package (Q-DPAK) for HDSOP-22, quadruple discrete package in half-bridge configuration (Q-DPAK Dual) for HDSOP-16-221 or transistor outline leadless top-side cooling package (TOLT) for HDSOP-16-x. Versions with bottom-side cooling (BSC) and top-side cooling (TSC) are available depending on the product. The top-side heat-slug allows to decouple the thermal drain from the mounting board performance. The dual row gullwing shaped leads allow for high-throughput board mounting using surface mount technology (SMT). The lead construction causes a stand-off distance between the gullwing foot landing area and the exposed die pad plane which has to be considered during board mount design. Typical products are linear voltage regulators, controllers, power switches, full-bridge ICs, drivers, and more.